Patents by Inventor Bock Kee Min

Bock Kee Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device
    Patent number: 9117986
    Abstract: A light emitting device may be provided that includes a conductive support member, a first conductive layer, a second conductive layer, an insulation layer between the first conductive layer and the second conductive layer, and a light emitting structure that includes a second semiconductor layer on the second conductive layer, a first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer. The first conductive layer may include at least one conductive via that passes through the second conductive layer, the second semiconductor layer and the active layer. A top surface of the at least one conductive via is provided into the first semiconductor layer. The insulation layer may substantially surround a side wall of the conductive via.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: August 25, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jeong Hyeon Choi, Hyun Kyong Cho, Bock Kee Min
  • Light emitting device
    Patent number: 8866178
    Abstract: A light emitting device may be provided that includes a conductive support member, a first conductive layer, a second conductive layer, an insulation layer between the first conductive layer and the second conductive layer, and a light emitting structure that includes a second semiconductor layer on the second conductive layer, a first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer. The first conductive layer may include at least one conductive via that passes through the second conductive layer, the second semiconductor layer and the active layer. A top surface of the at least one conductive via is provided into the first semiconductor layer. The insulation layer may substantially surround a side wall of the conductive via.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: October 21, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jeong Hyeon Choi, Hyun Kyong Cho, Bock Kee Min
  • LIGHT EMITTING DEVICE
    Publication number: 20140117399
    Abstract: A light emitting device may be provided that includes a conductive support member, a first conductive layer, a second conductive layer, an insulation layer between the first conductive layer and the second conductive layer, and a light emitting structure that includes a second semiconductor layer on the second conductive layer, a first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer. The first conductive layer may include at least one conductive via that passes through the second conductive layer, the second semiconductor layer and the active layer. A top surface of the at least one conductive via is provided into the first semiconductor layer. The insulation layer may substantially surround a side wall of the conductive via.
    Type: Application
    Filed: January 8, 2014
    Publication date: May 1, 2014
    Inventors: Jeong Hyeon Choi, Hyun Kyong Cho, Bock Kee Min
  • LIGHT EMITTING DEVICE
    Publication number: 20140117400
    Abstract: A light emitting device may be provided that includes a conductive support member, a first conductive layer, a second conductive layer, an insulation layer between the first conductive layer and the second conductive layer, and a light emitting structure that includes a second semiconductor layer on the second conductive layer, a first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer. The first conductive layer may include at least one conductive via that passes through the second conductive layer, the second semiconductor layer and the active layer. A top surface of the at least one conductive via is provided into the first semiconductor layer. The insulation layer may substantially surround a side wall of the conductive via.
    Type: Application
    Filed: January 8, 2014
    Publication date: May 1, 2014
    Inventors: Jeong Hyeon CHOI, Hyun Kyong CHO, Bock Kee MIN
  • Light emitting device
    Patent number: 8643042
    Abstract: A light emitting device may be provided that includes a conductive support member, a first conductive layer, a second conductive layer, an insulation layer between the first conductive layer and the second conductive layer, and a light emitting structure that includes a second semiconductor layer on the second conductive layer, a first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer. The first conductive layer may include at least one conductive via that passes through the second conductive layer, the second semiconductor layer and the active layer. A top surface of the at least one conductive via is provided into the first semiconductor layer. The insulation layer may substantially surround a side wall of the conductive via. The first surface of the first semiconductor layer may include a first surface area, a second surface area and a recess having a bottom surface.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: February 4, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jeong Hyeon Choi, Hyun Kyong Cho, Bock Kee Min
  • LIGHT EMITTING DEVICE
    Publication number: 20120007118
    Abstract: A light emitting device may be provided that includes a conductive support member, a first conductive layer, a second conductive layer, an insulation layer between the first conductive layer and the second conductive layer, and a light emitting structure that includes a second semiconductor layer on the second conductive layer, a first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer. The first conductive layer may include at least one conductive via that passes through the second conductive layer, the second semiconductor layer and the active layer. A top surface of the at least one conductive via is provided into the first semiconductor layer. The insulation layer may substantially surround a side wall of the conductive via. The first surface of the first semiconductor layer may include a first surface area, a second surface area and a recess having a bottom surface.
    Type: Application
    Filed: July 8, 2011
    Publication date: January 12, 2012
    Inventors: Jeong Hyeon Choi, Hyun Kyong Cho, Bock Kee Min