Abstract: A pulsed laser beam engraves a groove pattern on substrate of material relatively transparent to the laser beam. The grooves of the pattern are filled with a filling material of different density or different electron density. The pattern of grooves filled with material of different density creates a spatial density modulation that forms the basic structure of various optical elements. By adjusting the flux density of the laser beam to exceed a material break-down threshold only in specific locations, the material ablation can be reduced to a diameter smaller than the diameter of the laser beam itself. The grooves fabricated in this manner can be filled with a deformable material under vacuum with subsequent exposure to air pressure or higher pressure. It is also possible to fill the grooves with nanoparticles of different density and secured by heat application or with a coating.

Abstract: An apparatus for shaping the output beam of a strip of lasers, or an array of such strips, comprising a first reflective member including at least a first reflective element for deflecting a first portion of the output beam in a first direction oriented at a first angle in the slow axis direction and at a second angle in the fast axis direction, and at least a second reflective member including at least a first reflective element for deflecting the first output beam portion from the first direction to a second direction in the Z axis. The output beam is thus shaped to define at least two beams comprising at least the first portion and a remainder of the output beam which is propagated along the Z axis without deflection by any reflective member, with the first portion of the output beam being oriented approximately parallel to the un-deflected remainder.

Abstract: The specification discloses an apparatus for shaping part of the collective output beam of a plurality of semiconductor lasers, the plurality of semiconductor lasers being arranged to define a plurality of light-emitting areas and a plurality of non-light-emitting areas, and the semiconductor lasers having dimensions in X, Y and Z axes, wherein the Y axis defines a fast axis, the X axis defines a slow axis, and the Z axis defines an axis of propagation for the output beam.

Abstract: A laser material processing head for monitoring and adjusting a laser welding process. The present invention provides a laser material processing head having a laser source for providing a laser beam for laser welding a workpiece. A position sensor coupled to the laser material processing head measures the difference between the actual position of the workpiece and a predetermined theoretical position of the workpiece. An adjustment mechanism allows for adjustment of the laser beam in response to the position sensor. A closed loop controller interfaces the position sensor with the adjustment mechanism thereby providing a closed loop system within the laser material processing head.

Abstract: An apparatus for adjusting the width of a coherent or partially coherent beam of light comprising at least one pair of opposing reflectors each having an inwardly facing light reflecting surface, the reflectors being pivotally mounted with respect to said optical axis and means for adjusting the angle of said pivotally mounted reflector with respect to said optical axis.

Abstract: A laser material processing head for monitoring and adjusting a laser welding process. The present invention provides a laser material processing head having a laser source for providing a laser beam for laser welding a workpiece. A position sensor coupled to the laser material processing head measures the difference between the actual position of the workpiece and a predetermined theoretical position of the workpiece. An adjustment mechanism allows for adjustment of the laser beam in response to the position sensor. A closed loop controller interfaces the position sensor with the adjustment mechanism thereby providing a closed loop system within the laser material processing head.