Abstract: Various embodiments include a tool for fitting a stator into a housing comprising: a housing mounting; a tool holder; and a stator gripper. The housing mounting includes a positioning device for holding the housing. The tool holder defines a tool holder volume and has a receiving opening. The stator gripper is arranged in the tool holder and moves between a first position and a second position. The stator gripper comprises a gripper head for holding the stator, in the first position, the gripper head is arranged in the tool holder volume and, in the second position, the gripper head is guided, at least in one section, through the receiving opening. The housing mounting and/or the tool holder move toward one another or away from one another. The housing mounting or the tool holder or the stator gripper includes a pressure medium feed opening.

Abstract: Various embodiments include a tool for fitting a stator into a housing comprising: a housing mounting; a tool holder; and a stator gripper. The housing mounting includes a positioning device for holding the housing. The tool holder defines a tool holder volume and has a receiving opening. The stator gripper is arranged in the tool holder and moves between a first position and a second position. The stator gripper comprises a gripper head for holding the stator, in the first position, the gripper head is arranged in the tool holder volume and, in the second position, the gripper head is guided, at least in one section, through the receiving opening. The housing mounting and/or the tool holder move toward one another and away from one another. The housing mounting and/or the tool holder and/or the stator gripper includes a pressure medium feed opening.

Abstract: An electrically conductive substrate is provided with a predetermined electrical pattern. A solder paste is deposited onto the electrically conductive substrate at pre-defined interconnection locations. A first encapsulant layer provided with a pattern of openings is placed onto the electrically conductive substrate. Back-contact solar cells are placed on the first encapsulant layer so as to have a match of the electrical pattern of the back-contact solar cells with the electrical pattern of the electrically conductive substrate. A second encapsulant layer is placed on the back-contact solar cells with a glass layer placed on the second encapsulant layer. Heat and pressure are applied to the components to cause the encapsulant materials to flow and form a monolithic photovoltaic module. A laser is applied to the solar cell from the side of the glass layer to cause the solder paste to reflow between each interconnection location and its matching connection location on the back-contact solar cell.