Abstract: A connector incorporating a module, in which an incorporated electrical component may be cooled efficiently and reliably, is provided. A transmission apparatus disposed inside a main body cover of a module-incorporating connector is provided with a ceramic board at which an electrical component and such are mounted. A metal cover touches an upper face of the electrical component. A portion of the metal cover is disposed in an insertion portion of the main body cover. Heat generated by the electrical component is propagated via the metal cover to the insertion portion of a first cover member. When the module-incorporating connector is connected to a socket of a device, the insertion portion is disposed inside an exterior case, in which temperature is controlled by an air conditioner, and cooling is performed reliably and efficiently.

Abstract: An interconnect system (30, 100) includes a transceiver module assembly (105) that is mountable in an industrial receptacle (28, 103). The receptacle mates to an industrial optical connector (34) to form an environmentally sealed connection. The receptacle has an interior passageway (143, 162) and mating means (124) for attaching the module assembly. The module assembly includes a spring-loaded module cage (50) for receiving active devices (48), such as SFP transceivers. The spring-loaded module cage can adjust its position within the receptacle to accommodate different type of modules from various vendors. When attached to the platform, the module assembly is positioned so that the cage's open end is accessible through the receptacle's passageway. Users have the option of plugging/unplugging the transceiver module either through the passageway or by removing the module assembly from the receptacle.

Abstract: A connector incorporating a module, in which an incorporated electrical component may be cooled efficiently and reliably, is provided. A transmission apparatus disposed inside a main body cover of a module-incorporating connector is provided with a ceramic board at which an electrical component and such are mounted. A metal cover touches an upper face of the electrical component. A portion of the metal cover is disposed in an insertion portion of the main body cover. Heat generated by the electrical component is propagated via the metal cover to the insertion portion of a first cover member. When the module-incorporating connector is connected to a socket of a device, the insertion portion is disposed inside an exterior case, in which temperature is controlled by an air conditioner, and cooling is performed reliably and efficiently.

Abstract: A connector incorporating a module, in which an incorporated electrical component may be cooled efficiently and reliably, is provided. A transmission apparatus disposed inside a main body cover of a module-incorporating connector is provided with a ceramic board at which an electrical component and such are mounted. A metal cover touches an upper face of the electrical component. A portion of the metal cover is disposed in an insertion portion of the main body cover. Heat generated by the electrical component is propagated via the metal cover to the insertion portion of a first cover member. When the module-incorporating connector is connected to a socket of a device, the insertion portion is disposed inside an exterior case, in which temperature is controlled by an air conditioner, and cooling is performed reliably and efficiently.

Abstract: A connector incorporating a module, in which an incorporated electrical component may be cooled efficiently and reliably, is provided. A transmission apparatus disposed inside a main body cover of a module-incorporating connector is provided with a ceramic board at which an electrical component and such are mounted. A metal cover touches an upper face of the electrical component. A portion of the metal cover is disposed in an insertion portion of the main body cover. Heat generated by the electrical component is propagated via the metal cover to the insertion portion of a first cover member. When the module-incorporating connector is connected to a socket of a device, the insertion portion is disposed inside an exterior case, in which temperature is controlled by an air conditioner, and cooling is performed reliably and efficiently.

Abstract: The connector system provides two identical hermaphroditic housings, which accomplish a reliable connection of standard optical fiber connectors without the use of an adaptor. The connector system includes a first housing mounted to a first printed wiring board and a second housing mounted to a second printed wiring board. Each housing supports an optical fiber connector therein. Each housing includes an inner member and an outer member. Springs are provided between the inner and outer members to provide biasing of the housings in the mating direction of the optical connectors.

Abstract: The connector system provides two identical hermaphroditic housings, which accomplish a reliable connection of standard optical fiber connectors without the use of an adaptor. The connector system includes a first housing mounted to a first printed wiring board and a second housing mounted to a second printed wiring board. Each housing supports an optical fiber connector therein. Each housing includes an inner member and an outer member Springs are provided between the inner and outer members to provide biasing of the housings in the mating direction of the optical connectors.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: An interconnect system (30, 100) includes a transceiver module assembly (105) that is mountable in an industrial receptacle (28, 103). The receptacle mates to an industrial optical connector (34) to form an environmentally sealed connection. The receptacle has an interior passageway (143, 162) and mating means (124) for attaching the module assembly. The module assembly includes a spring-loaded module cage (50) for receiving active devices (48), such as SFP transceivers. The spring-loaded module cage can adjust its position within the receptacle to accommodate different type of modules from various vendors. When attached to the platform, the module assembly is positioned so that the cage's open end is accessible through the receptacle's passageway. Users have the option of plugging/unplugging the transceiver module either through the passageway or by removing the module assembly from the receptacle.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: An interconnect system includes a transceiver module assembly that is mountable in an industrial receptacle. The receptacle mates to an industrial optical connector to form an environmentally sealed connection. The receptacle has an interior passageway and mating means for attaching the module assembly. The module assembly includes a spring-loaded module cage for receiving active devices, such as SFP transceivers. The spring-loaded module cage can adjust its position within the receptacle to accommodate different type of modules from various vendors. When attached to the platform, the module assembly is positioned so that the cage's open end is accessible through the receptacle's passageway. Users have the option of plugging/unplugging the transceiver module either through the passageway or by removing the module assembly from the receptacle.

Abstract: A latching mechanism that is convenient to use and able to last through many duty cycles. The latching mechanisn includes a housing having one or more spring biased latches extending outwardly from the housing to automatically lock the housing into place during installation of the device. The latching system further includes an actuating sleeve configured to retract the latches when the actuating sleeve is pulled forward for easy and quick removal of the device.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.