Abstract: A method of erasing, during an erase operation, a non-volatile memory (NVM) cell of a memory device is disclosed. The erasing includes applying a first HV signal (VPOS) to a common source line (CSL). The CSL is shared among NVM cells of a sector of NVM cells. The first HV signal is above a highest voltage of a power supply. The erasing also includes applying the first HV signal to a local bit line (BL).

Abstract: A method of erasing, during an erase operation, a non-volatile memory (NVM) cell of a memory device is disclosed. The erasing includes applying a first HV signal (VPOS) to a common source line (CSL). The CSL is shared among NVM cells of a sector of NVM cells. The first HV signal is above a highest voltage of a power supply. The erasing also includes applying the first HV signal to a local bit line (BL).

Abstract: A system including a memory architecture is described. In one embodiment, the memory architecture includes an array of non-volatile memory cells, a first independently controlled voltage generation circuit, a plurality of register bits to store programmable values used by the independently controlled voltage generation circuit and a control circuit coupled to the first independently controlled voltage generation circuit. The first independently controlled voltage generation circuit is coupled to supply a positive voltage to the array during program and erase operations so that a magnitude of the positive voltage is applied across a storage note of an accessed memory cell of the array. The plurality of register bits to store programmable values used by the independently controlled voltage generation circuit to control the magnitude of the positive voltage. The control circuit controls a duration of the positive voltage. Other embodiments are also described.

Abstract: A system including a memory architecture is described. In one embodiment, the memory architecture includes an array of non-volatile memory cells, a first independently controlled voltage generation circuit, a plurality of register bits to store programmable values used by the independently controlled voltage generation circuit and a control circuit coupled to the first independently controlled voltage generation circuit. The first independently controlled voltage generation circuit is coupled to supply a positive voltage to the array during program and erase operations so that a magnitude of the positive voltage is applied across a storage note of an accessed memory cell of the array. The plurality of register bits to store programmable values used by the independently controlled voltage generation circuit to control the magnitude of the positive voltage. The control circuit controls a duration of the positive voltage. Other embodiments are also described.

Abstract: A system including a memory architecture is described. In one embodiment, the memory architecture includes an array of non-volatile memory cells, a first independently controlled voltage generation circuit, a plurality of register bits to store programmable values used by the independently controlled voltage generation circuit and a control circuit coupled to the first independently controlled voltage generation circuit. The first independently controlled voltage generation circuit is coupled to supply a positive voltage to the array during program and erase operations so that a magnitude of the positive voltage is applied across a storage node of an accessed memory cell of the array. The plurality of register bits to store programmable values used by the independently controlled voltage generation circuit to control the magnitude of the positive voltage. The control circuit controls a duration of the positive voltage. Other embodiments are also described.

Abstract: A method of erasing, during an erase operation, a non-volatile memory (NVM) cell of a memory device is disclosed. The erasing includes applying a first HV signal (VPOS) to a common source line (CSL). The CSL is shared among NVM cells of a sector of NVM cells. The first HV signal is above a highest voltage of a power supply. The erasing also includes applying the first HV signal to a local bit line (BL).

Abstract: A method of erasing, during an erase operation, a non-volatile memory (NVM) cell of a memory device is disclosed. The erasing includes applying a first HV signal (VPOS) to a common source line (CSL). The CSL is shared among NVM cells of a sector of NVM cells. The first HV signal is above a highest voltage of a power supply. The erasing also includes applying the first HV signal to a local bit line (BL).

Abstract: A biasing circuit includes cascoded transistors including a first transistor and a second transistor. A first gate of the first transistor is coupled to a second gate of the second transistor at a first node. The circuit also includes a voltage control circuit coupled to at least one of the first transistor or the second transistor. The voltage control circuit is configured to change a voltage level of at least one of the first transistor or the second transistor to allow voltage domain transition of an output signal in view of a change in state of an input signal without ramping a supply signal of the biasing circuit.

Abstract: A method of erasing, during an erase operation, a non-volatile memory (NVM) cell of a memory device is disclosed. The erasing includes applying a first HV signal (VPOS) to a common source line (CSL). The CSL is shared among NVM cells of a sector of NVM cells. The first HV signal is above a highest voltage of a power supply. The erasing also includes applying the first HV signal to a local bit line (BL).

Abstract: A biasing circuit includes cascoded transistors including a first transistor and a second transistor. A first gate of the first transistor is coupled to a second gate of the second transistor at a first node. The circuit also includes a voltage control circuit coupled to at least one of the first transistor or the second transistor. The voltage control circuit is configured to change a voltage level of at least one of the first transistor or the second transistor to allow voltage domain transition of an output signal in view of a change in state of an input signal without ramping a supply signal of the biasing circuit.

Abstract: A system including a memory architecture is described. In one embodiment, the memory architecture includes an array of non-volatile memory cells, a first independently controlled voltage generation circuit, a plurality of register bits to store programmable values used by the independently controlled voltage generation circuit and a control circuit coupled to the first independently controlled voltage generation circuit. The first independently controlled voltage generation circuit is coupled to supply a positive voltage to the array during program and erase operations so that a magnitude of the positive voltage is applied across a storage note of an accessed memory cell of the array. The plurality of register bits to store programmable values used by the independently controlled voltage generation circuit to control the magnitude of the positive voltage. The control circuit controls a duration of the positive voltage. Other embodiments are also described.

Abstract: Apparatus, systems, and methods for providing high voltage to memory devices are provided. One apparatus includes a low voltage input and a two-rail level shifting. The two-rail level shifting is configured to increase the low voltage or to decrease the low voltage to an amount that is less than or equal to a ground potential based on the amount of the low voltage. A system includes a low voltage input for receiving a voltage and a two-rail level shifting coupled to the low voltage input. The two-rail level shifting is configured to increase the voltage to a positive voltage if the voltage is equal to a ground potential and decrease the voltage to a negative voltage if the voltage is greater than the ground potential. One method includes receiving a voltage, modifying the voltage to generate one of a plurality of output voltages, and providing the output voltage to a memory device.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: Apparatus, systems, and methods for providing high voltage to memory devices are provided. One apparatus includes a low voltage input and a two-rail level shifting. The two-rail level shifting is configured to increase the low voltage or to decrease the low voltage to an amount that is less than or equal to a ground potential based on the amount of the low voltage. A system includes a low voltage input for receiving a voltage and a two-rail level shifting coupled to the low voltage input. The two-rail level shifting is configured to increase the voltage to a positive voltage if the voltage is equal to a ground potential and decrease the voltage to a negative voltage if the voltage is greater than the ground potential. One method includes receiving a voltage, modifying the voltage to generate one of a plurality of output voltages, and providing the output voltage to a memory device.

Abstract: Flash memory devices and systems are provided. One flash memory device includes an n-channel metal oxide semiconductor field-effect transistor (nMOSFET), a silicon-oxide-nitride-oxide silicon (SONOS) transistor coupled to the nMOSFET, and an isolated p-well coupled to the nMOSFET and the SONOS transistor. A flash memory system includes an array of memory devices divided into a plurality of paired sectors, a global bit line (GBL) configured to provide high voltage to each respective sector during erase and program operations coupled to each of the plurality of sectors, and a plurality of sense amplifiers coupled between a respective pair of sectors. Methods for operating a flash memory are also provided. One method includes providing high voltage, via the GBL, to the paired sectors during erase and program operations and providing low voltage, via a local bit line, to each memory device during read operations.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: A circuit is configured to supply a first gate voltage (PG1) at a first voltage bias (VP1) to a source of a first transistor providing an output (WLS), providing the first voltage bias (VP1) to a second transistor and supplying a second voltage bias (VN1) and a second gate voltage (NG1) to a third transistor, the second transistor coupled in series to the third transistor and in parallel with the first transistor, to supply a third voltage bias (VP2) and a third gate voltage (PG2) to a fourth transistor, and a fourth voltage bias (VN2) and a fourth gate voltage (NG2) to a fifth transistor, the fourth transistor coupled in series to the fifth transistor, and the fourth and fifth transistors coupled to a gate of the second transistor, and to provide a fifth voltage bias (VN3) to a line connecting the third transistor to the fifth transistor.

Abstract: A circuit is configured to supply a first gate voltage (PG1) at a first voltage bias (VP1) to a source of a first transistor providing an output (WLS), providing the first voltage bias (VP1) to a second transistor and supplying a second voltage bias (VN1) and a second gate voltage (NG1) to a third transistor, the second transistor coupled in series to the third transistor and in parallel with the first transistor, to supply a third voltage bias (VP2) and a third gate voltage (PG2) to a fourth transistor, and a fourth voltage bias (VN2) and a fourth gate voltage (NG2) to a fifth transistor, the fourth transistor coupled in series to the fifth transistor, and the fourth and fifth transistors coupled to a gate of the second transistor, and to provide a fifth voltage bias (VN3) to a line connecting the third transistor to the fifth transistor.

Abstract: Flash memory devices and systems are provided. One flash memory device includes an n-channel metal oxide semiconductor field-effect transistor (nMOSFET), a silicon-oxide-nitride-oxide silicon (SONOS) transistor coupled to the nMOSFET, and an isolated p-well coupled to the nMOSFET and the SONOS transistor. A flash memory system includes an array of memory devices divided into a plurality of paired sectors, a global bit line (GBL) configured to provide high voltage to each respective sector during erase and program operations coupled to each of the plurality of sectors, and a plurality of sense amplifiers coupled between a respective pair of sectors. Methods for operating a flash memory are also provided. One method includes providing high voltage, via the GBL, to the paired sectors during erase and program operations and providing low voltage, via a local bit line, to each memory device during read operations.

Abstract: In embodiments described herein, a memory architecture has an array of non-volatile memory cells and a pair of independently controlled voltage pumps. The pair of voltage pumps is coupled for supplying both positive and negative voltage biases to the memory array during program and erase operations, such that a sum of the magnitudes of the positive and negative voltage biases is applied across a storage node of an accessed memory cell.