Patents by Inventor Bogdan Swedek
Bogdan Swedek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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APPARATUS AND METHODS FOR ACOUSTICAL MONITORING AND CONTROL OF THROUGH-SILICON-VIA REVEAL PROCESSING
Publication number: 20140329439Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.Type: ApplicationFiled: May 1, 2013Publication date: November 6, 2014Inventors: Xiong Yeu Chew, Kommisetti Subrahmanyam, Uday Mahajan, Bogdan Swedek, Rajeev Bajaj, Jianshe Tang -
Publication number: 20110287694Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.Type: ApplicationFiled: August 4, 2011Publication date: November 24, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Dominic J. Benvegnu, Bogdan Swedek, David J. Lischka
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Publication number: 20110209412Abstract: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.Type: ApplicationFiled: May 9, 2011Publication date: September 1, 2011Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Patent number: 7998358Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.Type: GrantFiled: October 31, 2006Date of Patent: August 16, 2011Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Bogdan Swedek, David J. Lischka
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Patent number: 7938714Abstract: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.Type: GrantFiled: October 1, 2009Date of Patent: May 10, 2011Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Patent number: 7931522Abstract: A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a surface of a substrate against the polishing pad on the platen, a monitoring module located in the cavity, the monitoring module including a light source and a detector, an optical head removably mounted in the recess in the top surface platen, and an optical fiber having a proximate end coupled to the monitoring module and a distal end held by the optical head holding the distal end of the optical fiber in a position to direct light through a window in the polishing pad to the surface of the substrate and receive reflected light from the surface of the substrate.Type: GrantFiled: October 14, 2009Date of Patent: April 26, 2011Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Publication number: 20100284007Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.Type: ApplicationFiled: July 26, 2010Publication date: November 11, 2010Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Patent number: 7764377Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.Type: GrantFiled: August 26, 2005Date of Patent: July 27, 2010Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Patent number: 7727049Abstract: A system. method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.Type: GrantFiled: November 22, 2006Date of Patent: June 1, 2010Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Bogdan Swedek
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Publication number: 20100075582Abstract: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.Type: ApplicationFiled: October 1, 2009Publication date: March 25, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Publication number: 20100035519Abstract: A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a surface of a substrate against the polishing pad on the platen, a monitoring module located in the cavity, the monitoring module including a light source and a detector, an optical head removably mounted in the recess in the top surface platen, and an optical fiber having a proximate end coupled to the monitoring module and a distal end held by the optical head holding the distal end of the optical fiber in a position to direct light through a window in the polishing pad to the surface of the substrate and receive reflected light from the surface of the substrate.Type: ApplicationFiled: October 14, 2009Publication date: February 11, 2010Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Patent number: 7651385Abstract: A polishing system includes a platen, a carrier head to hold a surface of a substrate against a polishing pad on the platen, a monitoring module including a light source and a detector, an optical fiber having a proximate end coupled to the monitoring module and a distal end, and an optical head removably mounted in the platen. The optical head holds the distal end of the optical fiber to direct light through a window in the polishing pad to the surface of the substrate and receive reflected light from the surface of the substrate, and the optical head is configured to adjust a distance from the distal end of the fiber to the window.Type: GrantFiled: August 20, 2007Date of Patent: January 26, 2010Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Patent number: 7614936Abstract: Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum source configured to provide a vacuum, a vacuum nozzle, and a vacuum line that connects the vacuum source to the vacuum nozzle. The source of gas and the delivery nozzle are configured to direct a flow of gas across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar.Type: GrantFiled: May 11, 2007Date of Patent: November 10, 2009Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Patent number: 7614933Abstract: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.Type: GrantFiled: November 27, 2007Date of Patent: November 10, 2009Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Publication number: 20080102734Abstract: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.Type: ApplicationFiled: November 27, 2007Publication date: May 1, 2008Applicant: APPLIED MATERIALS, INC.Inventors: Dominic Benvegnu, Jeffrey David, Bogdan Swedek
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Publication number: 20080099443Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.Type: ApplicationFiled: October 31, 2006Publication date: May 1, 2008Inventors: Dominic J. Benvegnu, Bogdan Swedek, David J. Lischka
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Publication number: 20080009227Abstract: A polishing system includes a platen, a carrier head to hold a surface of a substrate against a polishing pad on the platen, a monitoring module including a light source and a detector, an optical fiber having a proximate end coupled to the monitoring module and a distal end, and an optical head removably mounted in the platen. The optical head holds the distal end of the optical fiber to direct light through a window in the polishing pad to the surface of the substrate and receive reflected light from the surface of the substrate, and the optical head is configured to adjust a distance from the distal end of the fiber to the window.Type: ApplicationFiled: August 20, 2007Publication date: January 10, 2008Applicant: Applied Materials, Inc.Inventors: Dominic Benvegnu, Jeffrey David, Bogdan Swedek
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Patent number: 7306507Abstract: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.Type: GrantFiled: August 26, 2005Date of Patent: December 11, 2007Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek
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Publication number: 20070218812Abstract: Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum source configured to provide a vacuum, a vacuum nozzle, and a vacuum line that connects the vacuum source to the vacuum nozzle. The source of gas and the delivery nozzle are configured to direct a flow of gas across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar.Type: ApplicationFiled: May 11, 2007Publication date: September 20, 2007Inventors: Dominic Benvegnu, Jeffrey David, Bogdan Swedek
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Patent number: 7226339Abstract: Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum source configured to provide a vacuum, a vacuum nozzle, and a vacuum line that connects the vacuum source to the vacuum nozzle. The source of gas and the delivery nozzle are configured to direct a flow of gas across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar.Type: GrantFiled: August 26, 2005Date of Patent: June 5, 2007Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Bogdan Swedek