Patents by Inventor Boguslaw A. Nagorski
Boguslaw A. Nagorski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7476304Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.Type: GrantFiled: September 21, 2004Date of Patent: January 13, 2009Assignee: Novellus Systems, Inc.Inventors: Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Uzoh
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Patent number: 7211174Abstract: Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.Type: GrantFiled: October 28, 2002Date of Patent: May 1, 2007Assignee: Novellus Systems, Inc.Inventors: Bulent M Basol, Homayoun Talieh, Boguslaw A. Nagorski, Cyprian E. Uzoh, Jeffrey A. Bogart
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Publication number: 20070004316Abstract: An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.Type: ApplicationFiled: June 13, 2006Publication date: January 4, 2007Inventors: Jalal Ashjaee, Boris Govzman, Bernard Frey, Boguslaw Nagorski, Douglas Young, Bulent Basol, Homayoun Talieh
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Patent number: 7059944Abstract: An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.Type: GrantFiled: February 18, 2003Date of Patent: June 13, 2006Assignee: ASM Nutool, Inc.Inventors: Jalal Ashjaee, Boris Govzman, Bernard M. Frey, Boguslaw A. Nagorski, Douglas W. Young, Bulent M. Basol, Homayoun Talieh
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Patent number: 6969456Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: GrantFiled: December 28, 2001Date of Patent: November 29, 2005Assignee: ASM Nutool, Inc.Inventors: Konstantin Volodarsky, Boguslaw A. Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh
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Publication number: 20050034994Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.Type: ApplicationFiled: September 21, 2004Publication date: February 17, 2005Inventors: Jalal Ashjaee, Boguslaw Nagorski, Bulent Basol, Homayoun Talieh, Cyprian Uzoh
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Patent number: 6852208Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.Type: GrantFiled: October 3, 2002Date of Patent: February 8, 2005Assignee: NuTool, Inc.Inventors: Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Uzoh
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Publication number: 20030166382Abstract: An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.Type: ApplicationFiled: February 18, 2003Publication date: September 4, 2003Inventors: Jalal Ashjaee, Boris Govzman, Bernard M. Frey, Boguslaw A. Nagorski, Douglas W. Young, Bulent M. Basol, Homayoun Talieh
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Publication number: 20030089598Abstract: Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.Type: ApplicationFiled: October 28, 2002Publication date: May 15, 2003Inventors: Bulent M. Basol, Homayoun Talieh, Boguslaw A. Nagorski, Cyprian E. Uzoh, Jeffrey A. Bogart
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Publication number: 20030029731Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.Type: ApplicationFiled: October 3, 2002Publication date: February 13, 2003Inventors: Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Uzoh
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Patent number: 6482307Abstract: Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.Type: GrantFiled: December 14, 2000Date of Patent: November 19, 2002Assignee: NuTool, Inc.Inventors: Jalal Ashjaee, Boguslaw A. Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Uzoh
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Publication number: 20020121435Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: ApplicationFiled: December 28, 2001Publication date: September 5, 2002Inventors: Konstantin Volodarsky, Boguslaw A. Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh
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Patent number: 6352623Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.Type: GrantFiled: December 17, 1999Date of Patent: March 5, 2002Assignee: Nutool, Inc.Inventors: Konstantin Volodarsky, Boguslaw A. Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Uzoh, Homayoun Talieh
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Publication number: 20010035354Abstract: Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.Type: ApplicationFiled: December 14, 2000Publication date: November 1, 2001Applicant: Nu Tool Inc.Inventors: Jalal Ashjaee, Boguslaw A. Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Uzoh
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Patent number: 5593344Abstract: A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. This support has at least one fluid inlet connectable to a source of fluid at a higher pressure, at least one fluid outlet connectable to a fluid drain at a lower pressure, and at least one bearing surface over which fluid flows from the source to the drain. The polishing pad is supported by the fluid over the bearing surface for low-friction movement with respect to the support. Similar fluid bearings can be used in the wafer holder. An array of generally parallel grooves is provided on a belt support surface to reduce hydroplaning of a polishing belt. A turbine drive system rotates a wafer chuck in a wafer holder.Type: GrantFiled: October 11, 1994Date of Patent: January 14, 1997Assignee: Ontrak Systems, Inc.Inventors: David E. Weldon, Boguslaw A. Nagorski, Homayoun Talieh
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Patent number: 5558568Abstract: A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. The support includes multiple fluid bearings that support the polishing pad assembly on the support. These fluid bearings are arranged concentrically to provide concentric regions of support for the polishing pad assembly, and each fluid bearing is coupled to a respective source of pressurized fluid at a respective pressure.Type: GrantFiled: November 2, 1994Date of Patent: September 24, 1996Assignee: Ontrak Systems, Inc.Inventors: Homayoun Talieh, David E. Weldon, Boguslaw A. Nagorski
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Patent number: 4447019Abstract: A tape cartridge has a roller driven continuous resilient belt which supports a wide thin tape when transported in the vincinity of video recording machine heads. The belt turns a tape take-up reel at a peripheral speed greater than the belt turns a tape supply reel thereby applying tension to the tape as it is transported past the heads. Since the belt both supports and supplies tension to the tape, tape bounce is minimized in the vicinity of the machine heads. Separate idlers guide the belt and tape from the supply reel to the machine heads, and separate idlers guide the belt and the tape from the heads to the take-up reel allowing a smooth take-up reel to be built as the tape is transported.Type: GrantFiled: September 30, 1981Date of Patent: May 8, 1984Assignee: Fuji Photo Film Co., Ltd.Inventor: Boguslaw A. Nagorski