Patents by Inventor Bohao HU

Bohao HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11902740
    Abstract: A piezoelectric microphone, includes: a wafer substrate including a cavity; a plurality of cantilever beams with a piezoelectric deck structure; a fixed column; a plurality of flexible elastic members; and a connecting section. The plurality of cantilever beams each includes a fixed end and a free end suspended above the cavity. The plurality of cantilever beams is of a structure in which one end is narrow and the other end is wide, and the fixed end is relatively narrow. The fixed column is disposed at the center of the bottom surface of the cavity. The fixed ends of the plurality of cantilever beams are all connected to the top surface of the fixed column. A gap is provided between every two adjacent cantilever beams. The plurality of flexible elastic members is connected to free ends of two adjacent cantilever beams to enable the cantilever beams to vibrate synchronously.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: February 13, 2024
    Assignee: Wuhan MEMSonics Technologies Co., Ltd.
    Inventors: Chengliang Sun, Bohao Hu, Binghui Lin, Zhipeng Wu, Wei Zhu, Lei Wang, Yu Zhou
  • Patent number: 11805371
    Abstract: The present application discloses a piezoelectric micro electrical mechanical system (MEMS) microphone chip and a piezoelectric MEMS microphone, and relates to the technical field of piezoelectric devices. The piezoelectric MEMS microphone chip includes at least one substrate frame and at least one plurality of sound receiving beams arranged on the substrate frame. Each of the sound receiving beams includes a connecting beam and a cantilever beam. The connecting beam and the cantilever beam are staggered on a circumference. One ends of the plurality of sound receiving beams that face a geometric center of the a circumference are fixedly connected to one another in a center defined by the substrate frame, and one end of the connecting beam that is away from the geometric center is fixedly connected to the substrate frame.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: October 31, 2023
    Assignee: Wuhan MEMSonics Technologies Co., Ltd.
    Inventors: Chaoxiang Yang, Bohao Hu, Wenjuan Liu, Chengliang Sun, Bowoon Soon
  • Publication number: 20220182767
    Abstract: A piezoelectric microphone, includes: a wafer substrate including a cavity; a plurality of cantilever beams with a piezoelectric deck structure; a fixed column; a plurality of flexible elastic members; and a connecting section. The plurality of cantilever beams each includes a fixed end and a free end suspended above the cavity. The plurality of cantilever beams is of a structure in which one end is narrow and the other end is wide, and the fixed end is relatively narrow. The fixed column is disposed at the center of the bottom surface of the cavity. The fixed ends of the plurality of cantilever beams are all connected to the top surface of the fixed column. A gap is provided between every two adjacent cantilever beams. The plurality of flexible elastic members is connected to free ends of two adjacent cantilever beams to enable the cantilever beams to vibrate synchronously.
    Type: Application
    Filed: February 28, 2022
    Publication date: June 9, 2022
    Inventors: Chengliang SUN, Bohao HU, Binghui LIN, Zhipeng WU, Wei ZHU, Lei WANG, Yu ZHOU