Patents by Inventor Bohdan A. Wasiczko

Bohdan A. Wasiczko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5509598
    Abstract: A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: April 23, 1996
    Assignee: The BOC Group, Inc.
    Inventors: Harbhajan Nayar, Sean M. Adams, Neeraj Saxena, Bohdan A. Wasiczko
  • Patent number: 5205485
    Abstract: Method and apparatus for controlling the dew point in a reaction vessel in which a dew point reading is converted to an electric current signal which is coordinated with a preselected dew point range and translated into a frequency which is transmitted to a device that regulates the addition of liquid water to the reaction vessel.
    Type: Grant
    Filed: June 25, 1992
    Date of Patent: April 27, 1993
    Assignee: The BOC Group, Inc.
    Inventors: Dan N. Baciu, Bohdan A. Wasiczko