Patents by Inventor Bojan Tesanovic
Bojan Tesanovic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11662541Abstract: This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.Type: GrantFiled: October 25, 2018Date of Patent: May 30, 2023Assignee: AMS Sensors Singapore PTE. Ltd.Inventors: Bojan Tesanovic, Mario Cesana, Camilla Camarri, Hartmut Rudmann
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Publication number: 20220190186Abstract: We disclose an optoelectronic module comprising an optoelectronic device operable to emit or detect a wavelength of radiation, an optical element arranged on the optoelectronic device, the optical element being transparent to the wavelength of radiation capable of being emitted or detected by the optoelectronic device, and a wall configured to laterally enclose the optoelectronic device and the optical element, the wall being opaque to the wavelength of radiation capable of being emitted or detected by the optoelectronic device.Type: ApplicationFiled: March 27, 2020Publication date: June 16, 2022Inventors: Bojan Tesanovic, Ji Wang, QiChuan Yu, Alexander Bietsch
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Publication number: 20220176597Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respeType: ApplicationFiled: March 12, 2020Publication date: June 9, 2022Inventors: Bojan Tesanovic, Hartmut Rudmann, Nicola Spring, Sebastiano Lazzi Gazzini
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Patent number: 11296270Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.Type: GrantFiled: December 26, 2018Date of Patent: April 5, 2022Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Bojan Tesanovic, Nicola Spring
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Patent number: 11013123Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.Type: GrantFiled: October 9, 2019Date of Patent: May 18, 2021Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
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Patent number: 10877239Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.Type: GrantFiled: November 4, 2016Date of Patent: December 29, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
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Publication number: 20200395523Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.Type: ApplicationFiled: December 26, 2018Publication date: December 17, 2020Inventors: Bojan Tesanovic, Nicola Spring
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Publication number: 20200355885Abstract: This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.Type: ApplicationFiled: October 25, 2018Publication date: November 12, 2020Applicant: ams Sensors Singapore Pte. LtdInventors: Bojan TESANOVIC, Mario CESANA, Camilla CAMARRI, Hartmut RUDMANN
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Publication number: 20200045828Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.Type: ApplicationFiled: October 9, 2019Publication date: February 6, 2020Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
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Patent number: 10527762Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).Type: GrantFiled: February 24, 2017Date of Patent: January 7, 2020Assignee: AMS SENSORS SINGAPORE PTE. LTD.Inventors: Hartmut Rudmann, Susanne Westenhöfer, Bojan Tesanovic
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Patent number: 10510932Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.Type: GrantFiled: February 14, 2019Date of Patent: December 17, 2019Assignee: AMS SENSORS SINGAPORE PTE. LTD.Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
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Publication number: 20190214533Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.Type: ApplicationFiled: February 14, 2019Publication date: July 11, 2019Applicant: ams Sensors Singapore Pte. Ltd.Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
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Patent number: 10243111Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.Type: GrantFiled: June 23, 2017Date of Patent: March 26, 2019Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
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Patent number: 10204945Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.Type: GrantFiled: December 21, 2017Date of Patent: February 12, 2019Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Jukka Alasirniö, Bojan Tesanovic, Tobias Senn, Devanraj Kupusamy, Alexander Bietsch
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Publication number: 20180329175Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.Type: ApplicationFiled: November 4, 2016Publication date: November 15, 2018Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
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Publication number: 20180315911Abstract: An electrical-contact assembly includes electrical contacts with first and second electrical-contact surfaces on opposing sides of the assembly. The electrical-contact assembly is manufactured by a structurable process (e.g., photo-structurable process) and by electroplating. The first and second electrical-contact surfaces can be positioned with respect to each other with an accuracy, for example, of at least 5 microns. Further, the thickness of the electrical-contact assembly can be at most 17 microns in some cases. The electrical-contact assembly can include integrated active optoelectronic elements, overmolds, optical elements and non-transparent walls.Type: ApplicationFiled: October 24, 2016Publication date: November 1, 2018Inventors: Bojan Tesanovic, Peter Riel
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Publication number: 20180302990Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.Type: ApplicationFiled: October 7, 2016Publication date: October 18, 2018Inventors: Bojan Tesanovic, Simon Gubser, Robert Lenart, Mario Cesana
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Publication number: 20180138222Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.Type: ApplicationFiled: December 21, 2017Publication date: May 17, 2018Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Jukka Alasirniö, Bojan Tesanovic, Tobias Senn, Devanraj Kupusamy, Alexander Bietsch
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Patent number: 9887221Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.Type: GrantFiled: February 18, 2015Date of Patent: February 6, 2018Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Jukka Alasirniö, Bojan Tesanovic, Tobias Senn, Devanraj Kupusamy, Alexander Bietsch
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Publication number: 20180006192Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.Type: ApplicationFiled: June 23, 2017Publication date: January 4, 2018Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee