Abstract: An apparatus and method for securing a substantially circular wafer uses a chuck having a plurality of tensioning grooves each having at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck center and the vacuum source applied to the grooves, the wafer is held securely to the surface without distortion.

Abstract: A method and apparatus for scanning and acquiring 3D profile line data of an object, illustratively for use in an optical inspection system. A 3D scanning subsystem is provided in relative movement to the object being scanned. The subsystem is capable of simultaneously scanning different regions of the object with different exposure lengths.

Abstract: An apparatus and method are disclosed for securing a substantially circular wafer comprising a chuck comprising a plurality of tensioning grooves each comprising at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck centre and the vacuum source applied to the grooves, the wafer is held securely to the surface. Additionally, there is disclosed an apparatus for securing a wafer comprising a chuck and a collar comprising a rigid support and an o-ring, the o-ring having a diameter slightly smaller than the outer perimeter. When the wafer is lowered onto the surface in a position concentric with the check centre, the collar is placed against the upper surface concentric with the perimeter and the vacuum source is applied securing the wafer to the surface.

Abstract: A method and apparatus for scanning and acquiring 3D profile line data of an object, illustratively for use in an optical inspection system. A 3D scanning subsystem is provided in relative movement to the object being scanned. The subsystem is capable of simultaneously scanning different regions of the object with different exposure lengths.

Abstract: The present invention relates to optical inspection of manufactured products, such as integrated circuits wafer bumps. There are provided methods and apparatus for acquisition of optical inspection data of said object, as well as for optical inspection and manufacturing of said object. The invention comprises a 2D optical scanning system and a 3D optical scanning system that can have common image trigger control and/or operate simultaneously without interference to have the same field of view.

Abstract: The invention relates to optical inspection of integrated circuit devices, such as QFP and TSOP devices. There are provided methods of inspecting objects, such as integrated circuit devices, using a single laser triangulation system oriented in a fixed direction, where the given inspection system rotates the inspection tray for scanning the objects placed therein in different directions.

Abstract: The invention relates to optical inspection of integrated circuit devices, such as QFP and TSOP devices. There are provided methods of inspecting objects, such as integrated circuit devices, using a single laser triangulation system oriented in a fixed direction, where the given inspection system rotates the inspection tray for scanning the objects placed therein in different directions.

Abstract: The present invention relates to optical inspection of manufactured products, such as integrated circuits wafer bumps. There are provided methods and apparatus for acquisition of optical inspection data of said object, as well as for optical inspection and manufacturing of said object. The invention comprises a 2D optical scanning system and a 3D optical scanning system that can have common image trigger control and/or operate simultaneously without interference to have the same field of view.

Abstract: For computing the absolute height, in a field of view of a CCD-based acquisition system, of the profile of an object moving on an assembly line, two CCD-based image acquisition devices are used. The consecutive acquired images of the two CCD-based image acquisition devices are shifted by a predefined number of lines. Using two relative heights, the absolute height of a feature located in the acquired images is computed.

Abstract: The present invention provides a method and apparatus for increasing the frame acquisition rate of an frame transfer CCD sensor by triggering the charge transfer signal TR, which controls the shift of the electrical charges from the light-sensitive cells into the vertical shift register, more than once per frame period, so that more than one image is acquired in the same frame, one above the other. The apparatus is used primarily for surface geometry inspection of high-speed moving objects, wherein acquired CCD images are thin, substantially horizontal profile lines.

Abstract: For computing the absolute height, in a field of view of a CCD-based acquisition system, of the profile of an object moving on an assembly line, two CCD-based image acquisition devices are used. The consecutive acquired images of the two CCD-based image acquisition devices are shifted by a predefined number of lines. Using two relative heights, the absolute height of a feature located in the acquired images is computed.

Abstract: The present invention provides a method and apparatus for increasing the frame acquisition rate of an interline transfer CCD sensor by triggering the charge transfer signal TR, which controls the shift of the electrical charges from the light-sensitive cells into the vertical shift register, more than once per frame period, so that more than one image is acquired in the same frame, one above the other. The apparatus is used primarily for surface geometry inspection of high-speed moving objects, wherein acquired CCD images are thin, substantially horizontal profile lines.

Abstract: The leads of a QFP are examined by an optical system. The optical system includes a sensor head having two lasers, the outputs of the lasers being fed to a beam splitter which provides outputs at right angles to each other, and a ring-light which is disposed under the beam splitter and in actual alignment with the beam splitter. The sensor head is carried by a carriage in a single plane along two transverse directions. The carriage moves the sensor heads so as to examine one lead at a time along the peripheral edges of the QFP.