Patents by Inventor Bok Eng Chea

Bok Eng Chea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STIFFENER FOR A PACKAGE SUBSTRATE
    Publication number: 20190006294
    Abstract: Stiffener technology for electronic device packages is disclosed. A stiffener for a package substrate can include a top portion configured to be affixed to a top surface of a package substrate. The stiffener for a package substrate can also include a lateral portion extending from the top portion and configured to be disposed about a lateral side of the package substrate. An electronic device package and associated systems and methods are also disclosed.
    Type: Application
    Filed: June 7, 2018
    Publication date: January 3, 2019
    Applicant: Intel Corporation
    Inventors: Jenny Shio Yin Ong, Seok Ling Lim, Kang Eu Ong, Bok Eng Chea, Jackson Chung Peng Kong