Patents by Inventor Bok Kyu Lee
Bok Kyu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240138682Abstract: An electronic device may include: a first temperature sensor configured to measure a first temperature of a skin surface when a user comes into contact with a main body of the electronic device; a first heating element spaced apart from the first temperature sensor by a first predetermined distance; a second temperature sensor spaced apart from the first heating element by a second predetermined distance and configured to measure a second temperature inside the main body; and a processor configured to: estimate heat flux based on the first temperature and the second temperature; estimate a blood perfusion rate of the user based on a temperature of the first heating element and the first temperature, and estimate a core body temperature of a user based on the first temperature, the estimated heat flux, and the estimated blood perfusion rate.Type: ApplicationFiled: April 25, 2023Publication date: May 2, 2024Applicants: SAMSUNG ELECTRONICS CO., LTD., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Ho Taik LEE, Woochul KIM, Bok Soon KWON, Sang Kyu KIM, Gimin PARK, Sungho KIM, Jiyong KIM, Seungjai WOO, So Young LEE, Hong Soon RHEE
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Publication number: 20240145265Abstract: Proposed are a process fluid treatment apparatus capable of decomposing ozone in a process fluid more effectively, and a wafer cleaning apparatus and semiconductor manufacturing equipment including the same. The process fluid treatment apparatus treats the process fluid used for cleaning a wafer in the semiconductor manufacturing equipment, and includes a housing having an inner space configured to contain the process fluid, a spray nozzle configured to spray the process fluid containing ozone into the inner space in the form of mist, and a nozzle heater configured to heat the process fluid passing through the spray nozzle.Type: ApplicationFiled: April 29, 2023Publication date: May 2, 2024Applicant: SEMES CO., LTD.Inventors: Young Seop CHOI, Myung A JEON, Dong Uk LEE, Boo Seok YANG, Bok Kyu LEE
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Publication number: 20240091822Abstract: Provided are a liquid chemical tank module and a liquid chemical supply apparatus, the liquid chemical tank module including a tank body having a storage space capable of storing a liquid chemical, a gas ejector for ejecting an inert gas into the liquid chemical to reduce dissolved oxygen in the liquid chemical of the tank body, and a controller for applying a control signal to the gas ejector to control a flow rate of the inert gas, wherein the gas ejector includes a gas pipe extending into the storage space and at least partially dipped in the liquid chemical to supply the inert gas from outside of the tank body into the storage space, and a plurality of ejection nozzles along the extension direction of the gas pipe to eject the inert gas into the storage space or the liquid chemical in the storage space.Type: ApplicationFiled: August 29, 2023Publication date: March 21, 2024Inventors: Byungwoo SIM, Bok Kyu LEE
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Publication number: 20240091683Abstract: The present disclosure relates to a filter flushing device and a filter flushing method in which a filter can be flushed and which may include: a main body in which at least one filter can be mounted; a deionized (DI) water supply unit that can selectively supply a plurality of types of DI water having different temperatures to the filter mounted in the main body at desired time intervals, thereby flushing the filter; a drain unit that drains the DI water passing through the filter to the outside of the main body; and a control unit that is electrically connected to the DI water supply unit to apply a control signal to the DI water supply unit so that a temperature and a flow rate of the DI water supplied to the main body through the DI water supply unit can be controlled.Type: ApplicationFiled: July 19, 2023Publication date: March 21, 2024Inventors: Byungwoo SIM, Bok Kyu LEE
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Patent number: 11923219Abstract: The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.Type: GrantFiled: June 26, 2020Date of Patent: March 5, 2024Assignee: SEMES CO., LTD.Inventors: Youngseop Choi, Young Hun Lee, Yong-Jun Seo, Bok Kyu Lee, Miso Park
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Publication number: 20240042493Abstract: A spray unit in which a plurality of nozzle heads are integrally coupled and a substrate treatment apparatus including the spray unit are provided. The substrate treatment apparatus includes: a substrate support unit supporting a substrate and including a spin head, which rotates the substrate; a treatment liquid retrieval unit retrieving substrate treatment liquids used in treating the substrate; and a spray unit including a plurality of nozzle heads and pipes, which are connected to the nozzle heads, and providing the substrate treatment liquids onto the substrate through the nozzle heads and the pipes, wherein the nozzle heads are moved at the same time.Type: ApplicationFiled: July 7, 2023Publication date: February 8, 2024Inventors: Myung A. JEON, Young Seop Choi, Young Jin Kim, Eun Hyeok Choi, Bok Kyu Lee, Je Myung Cha, Kyu Hwan Chang
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Publication number: 20230339790Abstract: Provided are an ozone water decomposition apparatus and method that can decompose ozone water quickly and stably.Type: ApplicationFiled: November 10, 2022Publication date: October 26, 2023Inventors: Myung A JEON, Young Seop CHOI, Bok Kyu LEE, Kyu Hwan CHANG, Yong Sun KO
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Publication number: 20230212044Abstract: Disclosed is a method of decomposing ozone in ozone water. According to the present invention, a temperature of ozone water is increased by mixing ozone water with heated water, and the ozone in the ozone water is decomposed into oxygen by the increase in the temperature.Type: ApplicationFiled: December 29, 2022Publication date: July 6, 2023Applicant: SEMES CO., LTD.Inventors: Bok Kyu Lee, Byung Woo Sim, Yong Sun Ko, Young Seop Choi, Myung A Jeon
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Publication number: 20200411344Abstract: The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.Type: ApplicationFiled: June 26, 2020Publication date: December 31, 2020Applicant: SEMES CO., LTD.Inventors: Youngseop CHOI, Young Hun LEE, Yong-Jun SEO, Bok Kyu LEE, Miso PARK
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Patent number: 10079142Abstract: An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.Type: GrantFiled: May 26, 2016Date of Patent: September 18, 2018Assignee: SEMES CO., LTD.Inventors: Dae Min Kim, Sul Lee, Bok Kyu Lee, Jae Myoung Lee
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Publication number: 20160351385Abstract: An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.Type: ApplicationFiled: May 26, 2016Publication date: December 1, 2016Inventors: DAE MIN KIM, SUL LEE, BOK KYU LEE, JAE MYOUNG LEE
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Patent number: 9406501Abstract: Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.Type: GrantFiled: May 30, 2013Date of Patent: August 2, 2016Assignee: SEMES CO., LTD.Inventors: Yong Hee Lee, Bok Kyu Lee, Jongsu Choi
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Publication number: 20160118241Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.Type: ApplicationFiled: October 9, 2015Publication date: April 28, 2016Inventors: Seong Soo LEE, Keunje JO, Soon Kab KWON, Jong Han KIM, Bok Kyu LEE, Yoon-Jong JU
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Publication number: 20140298669Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.Type: ApplicationFiled: May 2, 2014Publication date: October 9, 2014Applicant: SEMES CO., LTD.Inventors: Young-Ju Jeong, Bok-Kyu Lee, Sun-Kyu Hwang, Jeong-Yong Bae, Soo-Bin Yong
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Patent number: 8793898Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.Type: GrantFiled: May 22, 2008Date of Patent: August 5, 2014Assignee: Semes Co., Ltd.Inventors: Young-Ju Jeong, Bok-Kyu Lee, Sun-Kyu Hwang, Jeong-Yong Bae, Soo-Bin Yong
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Publication number: 20140060575Abstract: Provided is a substrate treating method. The substrate treating method may include treating a substrate by using a chemical solution; rinsing the substrate by using pure water after treating the substrate by using the chemical solution; and treating the substrate by using an organic solvent, wherein the substrate treating method further includes coating the substrate with a hydrophobic membrane between the treating of the chemical solution and the treating of the organic solvent.Type: ApplicationFiled: August 28, 2013Publication date: March 6, 2014Applicant: SEMES CO. LTDInventors: Kang Suk Lee, Jae Myoung Lee, Bok Kyu Lee, Yong Hee Lee, Jin Bok Lee
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Publication number: 20130319457Abstract: Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.Type: ApplicationFiled: May 30, 2013Publication date: December 5, 2013Inventors: Yong Hee LEE, Bok Kyu LEE, Jongsu CHOI
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Publication number: 20130074359Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.Type: ApplicationFiled: November 2, 2012Publication date: March 28, 2013Applicant: SEMES CO., LTD.Inventors: Young-Ju JEONG, Bok-Kyu LEE, Sun-Kyu HWANG, Jeong-Yong BAE, Soo-Bin YONG
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Publication number: 20100146813Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.Type: ApplicationFiled: May 22, 2008Publication date: June 17, 2010Applicant: SEMES CO., LTD.Inventors: Young-Ju Jeong, Bok-Kyu Lee, Sun-Kyu Hwang, Jeong-Yong Bae, Soo-Bin Yong
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Publication number: 20090317981Abstract: Provided is a substrate treating method for selectively etching a surface of a substrate. In the substrate treating method, an etchant is supplied to a center portion of a rotating substrate through a first nozzle, and an etch prevention fluid is supplied through a second nozzle disposed at a predetermined position apart from the center portion of the substrate so as to dilute the etchant.Type: ApplicationFiled: June 24, 2009Publication date: December 24, 2009Inventors: Bok Kyu Lee, Jong Su Choi, Jun Kee Kang