Patents by Inventor Bok Sim Lim

Bok Sim Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip assembly process for ultra thin substrate and package on package assembly
    Patent number: 9397016
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: July 19, 2016
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
    Publication number: 20150076692
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: September 29, 2014
    Publication date: March 19, 2015
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • Flip chip assembly process for ultra thin substrate and package on package assembly
    Patent number: 8847368
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: September 30, 2014
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee One
  • FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
    Publication number: 20120319276
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: August 31, 2012
    Publication date: December 20, 2012
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee One
  • Flip chip assembly process for ultra thin substrate and package on package assembly
    Patent number: 8258019
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: September 4, 2012
    Assignee: Intel Corporation
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong
  • Stacked package-on-package semiconductor device and methods of fabricating thereof
    Publication number: 20100120199
    Abstract: Methods for fabricating a semiconductor package are provided, by coupling a plurality of first interconnects and a semiconductor die to a first surface of a substrate, and depositing a mold material on the first surface by compression molding to fully encapsulate the die and to partially encapsulate the first interconnects.
    Type: Application
    Filed: November 7, 2008
    Publication date: May 13, 2010
    Inventors: Bok Sim Lim, A. Vethanayagam Rudge
  • FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
    Publication number: 20090321928
    Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventors: Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim, Tean Wee Ong