Patents by Inventor Bokgun Moon

Bokgun Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding apparatus and method thereof
    Publication number: 20110290860
    Abstract: The present invention provides a wire bonding apparatus including: a lead frame loading unit for loading a lead frame, on which a semiconductor chip is mounted, on a transfer rail; a heater block for heating the loaded lead frame; a wire bonding tool for wire-bonding the semiconductor chip and leads of the lead frame; a lead frame unloading unit for unloading the wire-bonded lead frame from the transfer rail; and a control unit for detecting a wire bonding failure when the wire bonding failure occurs in the lead frame and separating the heater block from the lead frame after a predetermined time has elapsed from the occurrence of the wire bonding failure, and a method thereof.
    Type: Application
    Filed: May 2, 2011
    Publication date: December 1, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sijoong Yang, Bokgun Moon, Sanghun Park