Patents by Inventor Bolong Zhang

Bolong Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and systems for predicting silicon density for a metal layer of semi-conductor chip via machine learning
    Patent number: 11797744
    Abstract: A specification for a semi-conductor chip is received. The specification specifies a set of photomasks associated with a metal layer of the semi-conductor chip. Multiple portions of an area of the metal layer are identified. A respective image is generated for each portion of the area based on the photomasks. A respective drawn density of metal wires for each portion of the area is calculated. A trained machine learning model is invoked to predict a respective silicon density of metal wires for each respective portion of the area based on an image and a drawn density for the respective portion of the area. A silicon density for the area of the metal layer is calculated based on a combination of predicted silicon densities for the multiple portions of the area. The combination is based on an average value of the predicted silicon densities for the multiple portions of the area.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: October 24, 2023
    Assignee: ANSYS Inc.
    Inventors: Wen-Tze Chuang, Norman Chang, Lei Yin, Bolong Zhang, Xi Chen, Jay Prakash Pathak, En Cih Yang, Jimin Wen, Akhilesh Kumar, Ming-Chih Shih, Ying Shiun Li