Patents by Inventor Bolun WANG

Bolun WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966683
    Abstract: A method and a system for comprehensively evaluating reliability of a multi-chip parallel IGBT module are provided. The method includes: establishing a gate-emitter voltage reliability model of the multi-chip parallel IGBT module, performing a chip fatigue failure test, and selecting a gate-emitter voltage as a failure characteristic quantity; establishing a transconductance reliability model of the multi-chip parallel IGBT module, performing a bonding wire shedding failure test, and selecting a transmission characteristic curve of the module as a failure characteristic quantity; using a Pearson correlation coefficient to characterize a degree of health of the IGBT module, and respectively calculating degrees of health PPMCCC and PPMCCB in different degrees of chip fatigue and bonding wire shedding failure states; and comprehensively evaluating the reliability of the multi-chip parallel IGBT module according to PPMCCC and PPMCCB.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 23, 2024
    Assignee: WUHAN UNIVERSITY
    Inventors: Yigang He, Chenyuan Wang, Lie Li, Bolun Du, Hui Zhang, Liulu He
  • Publication number: 20230339768
    Abstract: Described herein is a process for converting halocarbons into inorganic salts comprising a halogen, the process comprising reacting a halocarbon with a metal salt to produce the inorganic salt comprising a halogen; wherein the metal salt comprises a metal and an electronegative element selected from nitrogen, oxygen, sulfur, chlorine, selenium, bromine and iodine, or a mixture thereof; wherein the halogen of the halocarbon is more electronegative than the electronegative element of the metal salt.
    Type: Application
    Filed: August 11, 2021
    Publication date: October 26, 2023
    Inventors: Qiming WANG, Bolun WANG, Feng WENG
  • Patent number: 11648496
    Abstract: A treatment module including a housing having an input port and an output port; a plurality of treatment members, each treatment member having a skeleton and a mesh material provided over the skeleton, the mesh material being joined to the skeleton at one or more portions of the skeleton; and a layer of particles formed over a first side of the mesh material, the layer having pores of sufficient size to enable a fluid to flow through the layer.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: May 16, 2023
    Assignee: MicroHAOPs, Inc.
    Inventors: Mark Benjamin, Zhenxiao Cai, Alexander Vetrovs, Bolun Wang
  • Publication number: 20210039026
    Abstract: A treatment module including a housing having an input port and an output port; a plurality of treatment members, each treatment member having a skeleton and a mesh material provided over the skeleton, the mesh material being joined to the skeleton at one or more portions of the skeleton; and a layer of particles formed over a first side of the mesh material, the layer having pores of sufficient size to enable a fluid to flow through the layer.
    Type: Application
    Filed: October 14, 2020
    Publication date: February 11, 2021
    Inventors: Mark BENJAMIN, Zhenxiao CAI, Alexander VETROVS, Bolun WANG