Abstract: A method for selectively forming a shielding layer on a semiconductor device comprises: attaching a tape stack onto a predetermined area of a substrate of the semiconductor device, wherein the tape stack comprises a lower tape layer that covers the predetermined area and an upper tape layer that extends beyond the predetermined area and overhangs above an intermediate area adjacent to the predetermined area; applying a shielding layer to the substrate of the semiconductor device; and removing the tape stack and a portion of the shielding layer formed on the tape stack from the substrate of the semiconductor device.

Abstract: A method for making a semiconductor device is provided. The method comprises: providing a package substrate strip mounted thereon multiple sets of first electronic components and multiple sets of second electronic components; forming an encapsulant layer on the package substrate strip that covers the multiple sets of first electronic components; forming a first shielding material by spray coating such that the first shielding material extends continuously from a top surface of the encapsulant layer to a top surface of the package substrate strip to cover at least a side surface of the encapsulant layer facing towards the multiple sets of second electronic components; singulating the package substrate strip into individual semiconductor packages with respective package substrates; and forming a second shielding material on the encapsulant layer by sputtering, wherein the second shielding material at least partially overlaps with the first shielding material.

Abstract: A semiconductor device comprises a substrate comprising a conductive pattern and a conductive bar on the conductive pattern; at least one electronic component on the substrate; an encapsulant layer formed on the substrate and covering the at least one electronic component, a shielding layer extending at least partially over the substrate, the substrate comprises an opening over at least a portion of the conductive bar, the portion being exposed from the encapsulant layer and the substrate, the shielding layer extending within the opening and being electrically connected with the conductive bar in the opening, wherein the opening is adjacent to the encapsulant layer or is extended by an aperture in the encapsulant layer.

Abstract: A method for selectively forming a shielding layer on a semiconductor device comprises: attaching a tape stack onto a predetermined area of a substrate of the semiconductor device, wherein the tape stack comprises a lower tape layer that covers the predetermined area and an upper tape layer that extends beyond the predetermined area and overhangs above an intermediate area adjacent to the predetermined area; applying a shielding layer to the substrate of the semiconductor device; and removing the tape stack and a portion of the shielding layer formed on the tape stack from the substrate of the semiconductor device.