Patents by Inventor Bom-Son Lee

Bom-Son Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8344828
    Abstract: A metamaterial transmission line for transmitting an electromagnetic wave. The metamaterial transmission line may include a substrate including a substrate configured to include a an upper portion and a lower portion on which a ground plane is formed, a signal line configured to be formed on the substrate, and a defected ground structure configured to include an etched region and two metal portions, wherein the etched region is generated by etching a part of the ground plane and the metal portions extend from the signal line and are disposed on the etched region.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: January 1, 2013
    Assignees: Electronics and Telecommunications Research Institute, Kyung Hee University Industry Academic Cooperation Foundation
    Inventors: Bom-Son Lee, Tack-Gyu Kim, Jae-Ick Choi, Wang-Joo Lee
  • Publication number: 20110148550
    Abstract: A metamaterial transmission line for transmitting an electromagnetic wave. The metamaterial transmission line may include a substrate including a substrate configured to include a an upper portion and a lower portion on which a ground plane is formed, a signal line configured to be formed on the substrate, and a defected ground structure configured to include an etched region and two metal portions, wherein the etched region is generated by etching a part of the ground plane and the metal portions extend from the signal line and are disposed on the etched region.
    Type: Application
    Filed: July 21, 2010
    Publication date: June 23, 2011
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Bom-Son LEE, Tack-Gyu Kim, Jae-Ick Choi, Wang-Joo Lee