Patents by Inventor Bon Hyeok Gu

Bon Hyeok Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10252943
    Abstract: Provided are a cement mortar additive for extrusion molding, a cement mortar for extrusion molding, and an extrusion-molded product. The disclosed cement mortar additive for extrusion molding includes hydrogelated cellulose ether.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: April 9, 2019
    Assignee: LOTTE FINE CHEMICAL CO., LTD.
    Inventors: Bon Hyeok Gu, Tae Hong Kim, Won Hee Lee, Min Seok Kang, Myung Jae Lee, Myeong Ho Jeon, Gyu Chul Lee
  • Publication number: 20170210669
    Abstract: Provided are a cement mortar additive for extrusion molding, a cement mortar for extrusion molding, and an extrusion-molded product. The disclosed cement mortar additive for extrusion molding includes hydrogelated cellulose ether.
    Type: Application
    Filed: May 8, 2015
    Publication date: July 27, 2017
    Inventors: Bon Hyeok GU, Tae Hong KIM, Won Hee LEE, Min Seok KANG, Myung Jae LEE, Myeong Ho JEON, Gyu Chul LEE
  • Patent number: 9161443
    Abstract: Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes 5-25 parts by mole of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 parts by mole of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxyl group and a repeating unit (B?) derived from an aromatic diamine; 20-40 parts by mole of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 parts by mole of a repeating unit (D) derived from an aromatic diol; and 5-20 parts by mole of a repeating unit (E) derived from an aromatic amino carboxylic acid.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: October 13, 2015
    Assignee: SHENZHEN WOTE ADVANCED MATERIALS CO., LTD.
    Inventors: Yang Seob Kim, Bon Hyeok Gu, Mi Jeong Kim, Mahn Jong Kim
  • Publication number: 20140284085
    Abstract: Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes 5-25 parts by mole of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 parts by mole of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxyl group and a repeating unit (B?) derived from an aromatic diamine; 20-40 parts by mole of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 parts by mole of a repeating unit (D) derived from an aromatic diol; and 5-20 parts by mole of a repeating unit (E) derived from an aromatic amino carboxylic acid.
    Type: Application
    Filed: November 28, 2011
    Publication date: September 25, 2014
    Applicant: SAMSUNG FINE CHEMICALS CO., LTD.
    Inventors: Yang Seob Kim, Bon Hyeok Gu, Mi Jeong Kim, Mahn Jong Kim
  • Patent number: 7943856
    Abstract: A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: May 17, 2011
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd., Samsung Fine Chemicals Co., Ltd.
    Inventors: Yoo Seong Yang, Myung Sup Jung, Chung Kun Cho, Sang Hyuk Suh, Bon Hyeok Gu
  • Publication number: 20090151987
    Abstract: A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 18, 2009
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG ELECTRO-MECHANICS CO., LTD., SAMSUNG FINE CHEMICALS CO., LTD.
    Inventors: Yoo Seong YANG, Myung Sup JUNG, Chung Kun CHO, Sang Hyuk SUH, Bon Hyeok GU
  • Publication number: 20090117348
    Abstract: Compositions for producing a board and a printed circuit board produced using the composition are provided. The compositions can be used for the production of a variety of printed circuit boards.
    Type: Application
    Filed: November 3, 2008
    Publication date: May 7, 2009
    Applicants: Samsung Electronics Co.,Ltd., Samsung Electro-Mechanic Co., Ltd., Samsung Fine Chemicals Co., Ltd.
    Inventors: Chung Kun Cho, Myung Sup Jung, Yoo Seong Yang, Sang Hyuk Suh, Bon Hyeok Gu