Patents by Inventor Bon Seok Koo

Bon Seok Koo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200168388
    Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 28, 2020
    Inventors: Yoon Hee LEE, Bon Seok KOO, Yeon Tae KIM, Chang Hak CHOI, Jung Min KIM
  • Patent number: 10658116
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 10658117
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 10580567
    Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoon Hee Lee, Bon Seok Koo, Yeon Tae Kim, Chang Hak Choi, Jung Min Kim
  • Publication number: 20200066444
    Abstract: A capacitor component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes including first and second connection portions, and first and second band portions extending onto portions of a surface from the first and second connection portions, respectively; first and second plating layers disposed on the first and second band portions, respectively; humidity resistant layers disposed between the first and second external electrodes, disposed on the first and second external electrodes, and having openings respectively exposing portions of the first and second band portions. The first and second plating layers are disposed in the openings of the humidity resistant layers, respectively, and are in contact with the first and second band portions, respectively.
    Type: Application
    Filed: February 14, 2019
    Publication date: February 27, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Suong Yang, Bon Seok Koo, Sung Min Cho, Woong Do Jung, Hai Joon Lee
  • Publication number: 20190385795
    Abstract: A capacitor component includes a humidity resistant layer formed on a portion of the external surface of a body on which an external electrode is not formed, and further includes a humidity resistant layer disposed inside the external electrode, to improve humidity resistance reliability. The capacitor component includes an opening portion formed by removing a portion of the humidity resistant layer disposed inside the external electrode to improve electrical connection.
    Type: Application
    Filed: March 4, 2019
    Publication date: December 19, 2019
    Inventors: Jeong Suong YANG, Woong Do JUNG, Bon Seok KOO, Jong Suk HAN, Sung Min CHO
  • Patent number: 10454445
    Abstract: A common mode filter includes: a body including a filter portion; first and second external electrodes each including an electrode layer including conductive particles, intermetallic compound (IMC) formation particles, and a resin, and disposed on an external surface of the body; and first and second coils disposed in the filter portion, the first and second coils being connected through lead portions to the electrode layers of the first and second external electrodes, respectively. The conductive particles include a first conductive particle and a second conductive particle having a diameter smaller than that of the first conductive particle.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: October 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon Lee, Bon Seok Koo, Kun Hoi Koo, Sung Ryong Ma, Sung Jin Park, Ha Yoon Song
  • Patent number: 10446320
    Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: October 15, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Publication number: 20190295773
    Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
    Type: Application
    Filed: June 14, 2019
    Publication date: September 26, 2019
    Inventors: Jung Min KIM, Bon Seok KOO, Jung Wook SEO, Yoon Hee LEE, Kun Hoi KOO
  • Publication number: 20190252123
    Abstract: A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Inventors: Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Hae Sol KANG, Ji Hye HAN, Byung Woo KANG
  • Publication number: 20190206625
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Application
    Filed: February 8, 2019
    Publication date: July 4, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Publication number: 20190189349
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Application
    Filed: February 1, 2019
    Publication date: June 20, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 10320006
    Abstract: Disclosed herein are an interconnect for a solid oxide fuel cell and a method for manufacturing the same, the interconnect including: a conductive core; an oxidation-resistant insulating part receiving therein; and an oxidation-resistant conductive material layer coated on an exposed surface of the conductive core, which is exposed to an external environment by removing a portion of the oxidation-resistant insulating part, so that the interconnect can maintain durability against high-temperature heat generated from a flat type solid oxide fuel cell for a long time and thus have a very small voltage loss due to oxidation even with the use over a long-time period; have no sealing problem and no delaminating problem of a coating film due to a difference in coefficient of thermal expansion; be inexpensive; and have a simple structure.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: June 11, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Han Kim, Jong Ho Chung, Jong Sik Yoon, Bon Seok Koo
  • Patent number: 10319527
    Abstract: A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: June 11, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Hae Sol Kang, Ji Hye Han, Byung Woo Kang
  • Publication number: 20190013150
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes, and external electrodes disposed on at least one surface of the body. The external electrodes each includes an electrode layer in contact with the first or second internal electrodes, an intermediate layer disposed on the electrode layer and including a first intermetallic compound, and a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound and a base resin.
    Type: Application
    Filed: May 7, 2018
    Publication date: January 10, 2019
    Inventors: Kun Hoi KOO, Bon Seok KOO, Jung Min KIM, Jun Hyeon KIM, Hae Sol KANG, Soung Jin KIM, Ji Hye HAN, Byung Woo KANG, Chang Hak CHOI
  • Publication number: 20180286594
    Abstract: A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.
    Type: Application
    Filed: July 27, 2017
    Publication date: October 4, 2018
    Inventors: Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Hae Sol KANG, Ji Hye HAN, Byung Woo KANG
  • Publication number: 20180254138
    Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.
    Type: Application
    Filed: November 8, 2017
    Publication date: September 6, 2018
    Inventors: Kun Hoi KOO, Byung Woo KANG, Ji Hye HAN, Bon Seok KOO
  • Publication number: 20180234074
    Abstract: A common mode filter includes: a body including a filter portion; first and second external electrodes each including an electrode layer including conductive particles, intermetallic compound (IMC) formation particles, and a resin, and disposed on an external surface of the body; and first and second coils disposed in the filter portion, the first and second coils being connected through lead portions to the electrode layers of the first and second external electrodes, respectively. The conductive particles include a first conductive particle and a second conductive particle having a diameter smaller than that of the first conductive particle.
    Type: Application
    Filed: October 30, 2017
    Publication date: August 16, 2018
    Inventors: Sang Moon LEE, Bon Seok Koo, Kun Hoi Koo, Sung Ryong Ma, Sung Jin Park, Ha Yoon Song
  • Publication number: 20180033540
    Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.
    Type: Application
    Filed: March 29, 2017
    Publication date: February 1, 2018
    Inventors: Yoon Hee LEE, Bon Seok KOO, Yeon Tae KIM, Chang Hak CHOI, Jung Min KIM
  • Publication number: 20170301468
    Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
    Type: Application
    Filed: March 6, 2017
    Publication date: October 19, 2017
    Inventors: Jung Min KIM, Bon Seok KOO, Jung Wook SEO, Yoon Hee LEE, Kun Hoi KOO