Patents by Inventor Bong Gyun Kim

Bong Gyun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11186817
    Abstract: The present invention relates to an optimal medium for growing a cell line auxotrophic for tetrahydrofolate (THF) and producing a desired material in the cell with high efficiency. In particular, the present invention provides a method for enhancing cell growth by adding tetrahydrofolate (THF), or a precursor or derivative thereof into a chemical composition cell medium.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: November 30, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Hong-Woo Park, Bong Gyun Kim
  • Publication number: 20170009199
    Abstract: The present invention relates to an optimal medium for growing a cell line auxotrophic for tetrahydrofolate (THF) and producing a desired material in the cell with high efficiency, in particular, the present invention provides a method for enhancing cell growth by adding tetrahydrofolate (THF), or a precursor or derivative thereof into a chemical composition cell medium.
    Type: Application
    Filed: February 23, 2015
    Publication date: January 12, 2017
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Hong-Woo PARK, Bong Gyun KIM
  • Patent number: 8692136
    Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: April 8, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Jae Oh, Joo Yong Kim, Yoon Hyuck Choi, Bong Gyun Kim
  • Publication number: 20130299221
    Abstract: There is provided a space transformer for a probe card, including: a substrate having a first surface and a second; a plurality of first pads formed on the first surface to be spaced apart from each other and connected to a printed circuit board of a probe card; a plurality of second pads formed on the second surface in positions corresponding to those of the first pads and receiving external electrical signals applied thereto; a plurality of via electrodes penetrating through the substrate and respectively connected to the plurality of first pads and the plurality of second pads formed in the positions corresponding to each other; a ground layer formed to cover the second surface and provided with a plurality of second pad exposure holes; and an insulating layer formed to cover the ground layer and the plurality of second pads.
    Type: Application
    Filed: October 4, 2012
    Publication date: November 14, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jae OH, Yoon Hyuck CHOI, Bong Gyun KIM, Joo Yong KIM
  • Patent number: 8183473
    Abstract: Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: May 22, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gyu Man Hwang, Dae Hyeong Lee, Bong Gyun Kim
  • Publication number: 20120013360
    Abstract: There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.
    Type: Application
    Filed: December 9, 2010
    Publication date: January 19, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jae Oh, Joo Yong Kim, Yoon Hyuck Choi, Bong Gyun Kim
  • Publication number: 20120007781
    Abstract: There is provided an antenna module. The antenna module according to the present invention may include a patch antenna resonator formed on a surface of a dielectric substrate; and a surface wave-radiation resonator disposed to be separated from the patch antenna resonator, and formed to surround the patch antenna resonator so that signals from the patch antenna resonator are radiated. In this instance, the signals may flow on the surface of the dielectric substrate.
    Type: Application
    Filed: January 4, 2011
    Publication date: January 12, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joo Yong KIM, Dong Young KIM, Kwang Jae OH, Yun Hwi PARK, Bong Gyun KIM, Yoon Hyuck CHOI, Seok Chool YOON
  • Patent number: 8053682
    Abstract: There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: November 8, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yun Hwi Park, Bong Gyun Kim, Yoon Hyuck Choi
  • Publication number: 20110061929
    Abstract: Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.
    Type: Application
    Filed: November 18, 2009
    Publication date: March 17, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyu Man Hwang, Dae Hyeong Lee, Bong Gyun Kim
  • Patent number: 7886373
    Abstract: Provided is a method of controlling temperature of warm water of a bidet. The method includes: a first step of detecting a current temperature of warm water stored in a storage tank; a second step of gradually adjusting intensity of power supplied to a heating means depending on a difference when the current temperature of the warm water is lower than a target temperature; and a third step of cutting the power supplied to the heating means when the current temperature of the warm water is equal to the target temperature after the second step. Therefore, the warm water can be precisely maintained at a set temperature by checking a temperature of cleaning water in a storage tank using a sensor in real time, and gradually controlling intensity of power supplied to a heating means on the basis of the checked water temperature.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: February 15, 2011
    Assignee: Novita Co., Ltd.
    Inventor: Bong-Gyun Kim
  • Publication number: 20100055393
    Abstract: There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.
    Type: Application
    Filed: May 18, 2009
    Publication date: March 4, 2010
    Inventors: Yun Hwi PARK, Bong Gyun Kim, Yoon Hyuck Choi
  • Patent number: 7605808
    Abstract: Disclosed are an energy recovery apparatus and method for a plasma display panel. The energy recovery apparatus includes a sustain voltage source for supplying a sustain voltage, a panel capacitor formed equivalently at a discharge cell, a first charging circuit for forming a first charging path when one side of the panel capacitor is charged, a second charging circuit for forming a second charging path when the other side of the panel capacitor is charged, a first power circuit for supplying the sustain voltage to the panel capacitor and forming the first charging path, and a second power circuit for supplying a ground voltage generated from a ground voltage source to the panel capacitor and forming the second charging path. The energy recovery apparatus and method according to the present invention can decrease components in number and reduce power consumption and manufacturing cost by charging the other side of the panel capacitor using a charging voltage of one side of the panel capacitor.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: October 20, 2009
    Assignee: LG Electronics Inc.
    Inventors: Nam Kyu Lee, Bong Gyun Kim, Bong Hwan Kwon, Jang Hwan Cho
  • Publication number: 20070256225
    Abstract: Provided is a method of controlling temperature of warm water of a bidet. The method includes: a first step of detecting a current temperature of warm water stored in a storage tank; a second step of gradually adjusting intensity of power supplied to a heating means depending on a difference when the current temperature of the warm water is lower than a target temperature; and a third step of cutting the power supplied to the heating means when the current temperature of the warm water is equal to the target temperature after the second step. Therefore, the warm water can be precisely maintained at a set temperature by checking a temperature of cleaning water in a storage tank using a sensor in real time, and gradually controlling intensity of power supplied to a heating means on the basis of the checked water temperature.
    Type: Application
    Filed: October 27, 2006
    Publication date: November 8, 2007
    Applicant: NOVITA CO., LTD.
    Inventor: Bong-Gyun Kim
  • Patent number: 7151360
    Abstract: A power supply for power factor correction and a driving method thereof wherein a ripple current of a power factor correction circuit (PFC) can be reduced to enhance a power factor and an efficiency. In the power supply, a power factor correction circuit corrects a power factor of a AC voltage supplied from an AC voltage source using a switching device to convert it to a DC voltage. A DC to DC converter converts said DC voltage from the power factor correction circuit into a desired DC voltage. A controller controls the switching device in accordance with an input voltage inputted to the power factor correction circuit to vary an output voltage of the power factor correction circuit.
    Type: Grant
    Filed: July 19, 2004
    Date of Patent: December 19, 2006
    Assignee: LG Electronics Inc.
    Inventors: Bong Gyun Kim, Nam Kyu Lee, Hee Duk Oh