Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.

Abstract: A construction capable of easily coupling or disassembling two tubes. The construction has a first annular flange of an enclosing tube protruding radially outward, a telescoped tube inserted in the enclosing tube, a first seal member inserted between an outer surface of the telescoped tube and an outside cylindrical inner surface of the enclosing tube, a second seal member inserted between the outer surface of the telescoped tube and the outside cylindrical inner surface of the enclosing tube after the first seal member is inserted, and a coupler for coupling the enclosing tube and the second seal member.