Patents by Inventor Bong Jik Shin

Bong Jik Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090011099
    Abstract: Disclosed is a method for producing extruded noodles including mixing noodle materials; kneading the mixed noodle materials and mixing water into dough and gelatinizing the dough through a first extruder; cooling the gelatinized dough to a temperature of 40° C. or less; extruding strips of noodles from the gelatinized dough through a second extruder; cutting the extruded strips of noodles; putting a designated amount of the cut strips of noodles into a mold so as to mold the noodles; firstly drying the molded noodles at a temperature of 40˜70° C. under a relative humidity of 20% or more for 1˜20 minutes; and secondarily drying the firstly dried noodles at a temperature of 60˜100° C. for 30˜60 minutes. The dough is gelatinized through the first extruder without using a separate mixer, and then continuously passes through the second extruder without applying heat, thereby having an increased uniformity and allowing the extruded strips of noodles to be easily separated from each other.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 8, 2009
    Applicant: NONG SHIM CO., LTD
    Inventors: Jai Hoon Kim, Soo Hyun Park, Sung Ug Jung, Hyeon Jung Kim, Nam Jae Kang, Choon Sang Park, Seok June Son, Kyung Bae Kim, Kyung Hyun Noh, Jun Ho Hwang, Bong Jik Shin