Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.

Abstract: A transceiver security system which provides security to a transceiver user by transmitting information, including an encoded period of time and a request for help, to a computer server. After the period of time expires, an alert call is made from the computer server to the transceiver user. Depending on the response from the transceiver user, the computer server may contact an emergency service provider.

Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.