Patents by Inventor Bong-Jin Jeon

Bong-Jin Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250058303
    Abstract: The present invention relates to a catalyst for a hydrogenation reaction and a method for producing the same, and more specifically, to a catalyst for a hydrogenation reaction, wherein the catalyst includes nickel oxide as an active ingredient and copper oxide and sulfur oxide as a promoter, and especially, can control a reduction degree value according to whether or not a passivation layer of a nickel metal is removed.
    Type: Application
    Filed: November 3, 2024
    Publication date: February 20, 2025
    Inventors: Woo Jin PARK, Bong Sik Jeon, Yong Hee Lee, Eui Geun Jung
  • Patent number: 12211965
    Abstract: A display device includes a bank including an opening defining a plurality of pixels; a plurality of light emitting elements disposed in the plurality of pixels; a color conversion layer disposed on the plurality of light emitting elements in the opening; and a low refractive layer disposed on the color conversion layer in the opening.
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: January 28, 2025
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Young Gu Kim, Ji Yun Park, Bong Sung Seo, Jong Ho Son, Yeon Hee Lee, Baek Kyun Jeon, Kyung Seon Tak, Jae Jin Lyu
  • Patent number: 7255925
    Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: August 14, 2007
    Assignee: LG Chem, Ltd.
    Inventors: Hyuk-Sung Chung, Bong-Jin Jeon, Hyun-Cheol Kim, Eun-Hae Koo
  • Publication number: 20050124318
    Abstract: A transceiver security system which provides security to a transceiver user by transmitting information, including an encoded period of time and a request for help, to a computer server. After the period of time expires, an alert call is made from the computer server to the transceiver user. Depending on the response from the transceiver user, the computer server may contact an emergency service provider.
    Type: Application
    Filed: December 8, 2003
    Publication date: June 9, 2005
    Inventor: Bong Jin Jeon
  • Publication number: 20050080183
    Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.
    Type: Application
    Filed: September 3, 2004
    Publication date: April 14, 2005
    Inventors: Hyuk-Sung Chung, Bong-Jin Jeon, Hyun-Cheol Kim, Eun-Hae Koo