Patents by Inventor Bong Seok HAHN

Bong Seok HAHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for analyzing polishing behavior in CMP process of semiconductor wafers
    Patent number: 10773355
    Abstract: Disclosed herein are a method for analyzing polishing behavior and a device for the same. Herein, the method corresponds to a method for analyzing polishing behavior of a device for analyzing polishing behavior by at least one processor including the steps of setting up equipment shape variables, operation variables, and calculation variables corresponding to at least one configuration element being selected from one of a pad and a wafer, the pad and the wafer configuring a polishing device, generating calculation nodes based on the equipment shape variables, the operation variables, and the calculation variables, calculating a sliding distance on a wafer surface caused by the pad or a sliding distance on a pad surface caused by the wafer by using the calculation node, and outputting the calculated result.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: September 15, 2020
    Inventor: Bong Seok Hahn
  • METHOD AND DEVICE FOR ANALYZING POLISHING BEHAVIOR IN CMP PROCESS OF SEMICONDUCTOR WAFERS
    Publication number: 20190375069
    Abstract: Disclosed herein are a method for analyzing polishing behavior and a device for the same. Herein, the method corresponds to a method for analyzing polishing behavior of a device for analyzing polishing behavior by at least one processor including the steps of setting up equipment shape variables, operation variables, and calculation variables corresponding to at least one configuration element being selected from one of a pad and a wafer, the pad and the wafer configuring a polishing device, generating calculation nodes based on the equipment shape variables, the operation variables, and the calculation variables, calculating a sliding distance on a wafer surface caused by the pad or a sliding distance on a pad surface caused by the wafer by using the calculation node, and outputting the calculated result.
    Type: Application
    Filed: September 18, 2017
    Publication date: December 12, 2019
    Inventor: Bong Seok HAHN