Abstract: A winding member, including a winding core for an electrode assembly, winding a positive electrode plate, a negative electrode plate, and a first separator, the winding core including a pair of clamps extending along a longitudinal direction of the winding core a base portion coupled to a first and second end of each of the clamps the clamps being spaced apart from each other vertically around an insertion groove, the clamps including a first clamp and a second clamp extending along the longitudinal direction the first clamp including a pair of protrusions protruding in the direction of the second clamp on an inner surface of the first clamp, and at least one of the pair of protrusions fixing a winding-front end of the first separator inserted into the insertion groove to an inner surface of the second clamp.

Abstract: Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130?) covered by a conductive coating (130?) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

Abstract: A method of forming a semiconductor package comprises forming one or more first vias in a first side of a substrate and attaching a first side of a first microelectronic element to the first side of the substrate. The first microelectronic element is electrically coupled to at least one of the one or more first vias. The method further comprise obtaining a second microelectronic element including one or more second vias in a first side of the second microelectronic element, and attaching a second side of the substrate to the first side of the second microelectronic element. The second microelectronic element is electrically coupled to at least one of the one or more first vias. Each of one or more connecting elements has a first end attached to a first side of the second microelectronic element and a second end extends beyond a second side of the first microelectronic element.

Abstract: A variable-capacity swash plate-type compressor including: a lug plate coupled to a swash plate so as to be fixed to a driving shaft; and the swash plate coupled to the lug plate and having a varying inclination angle while making a rotational motion. The swash plate includes a body, and first and second arms that protrude from the body toward the lug plate and are spaced apart from each other. The lug plate includes a plate, a center lug arm that protrudes from the plate to be inserted between the first and second arms and is coupled to the body of the swash plate, and left and right lug arms that protrude from the plate to be spaced apart from each other and support both sides of each of the first and second arms.

Abstract: Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130?) covered by a conductive coating (130?) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

Abstract: Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130?) covered by a conductive coating (130?) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

Abstract: Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130?) covered by a conductive coating (130?) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

Abstract: Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130?) covered by a conductive coating (130?) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

Abstract: Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130?) covered by a conductive coating (130?) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

Abstract: A method of forming a semiconductor package comprises forming one or more first vias in a first side of a substrate and attaching a first side of a first microelectronic element to the first side of the substrate. The first microelectronic element is electrically coupled to at least one of the one or more first vias. The method further comprise obtaining a second microelectronic element including one or more second vias in a first side of the second microelectronic element, and attaching a second side of the substrate to the first side of the second microelectronic element. The second microelectronic element is electrically coupled to at least one of the one or more first vias. Each of one or more connecting elements has a first end attached to a first side of the second microelectronic element and a second end extends beyond a second side of the first microelectronic element.

Abstract: Disclosed herein are apparatuses and methods related to an electrohydrodynamic (EHD) fluid mover that includes emitter and collector electrodes energizable to motivate fluid flow therebetween. Ozone reducing catalyst bearing heat transfer surfaces may be disposed downstream of the emitter electrode in a flow path of the motivated fluid flow. A controller may be configured to, at respective times throughout the operating life of the EHD fluid mover, selectively employ at least one ozone reduction enhancement response selected from a set of responses. One response includes triggering a conditioning mechanism to apply an additional, but at least partially consumable, ozone reducing catalyst to a surface of the emitter electrode.