Patents by Inventor Bong Yong Kim

Bong Yong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240148698
    Abstract: The present invention relates to a pharmaceutical composition for preventing or treating alopecia areata acting as a functional antagonist for SIP receptor's subtypes S1PR1 and S1PR4, and more particularly, relates to a pharmaceutical composition containing as an active ingredient a sphingolipid compound acting as a functional antagonist for S1PR1 and S1PR4, does not cause cardiovascular side effects, and is effective in preventing or treating alopecia areata.
    Type: Application
    Filed: September 26, 2023
    Publication date: May 9, 2024
    Applicant: NEXTGEN BIOSCIENCE CO., LTD.
    Inventors: Bong Yong LEE, Yang Hae PARK, Eun Jeong KIM
  • Patent number: 11957665
    Abstract: The present invention relates to a pharmaceutical composition for preventing or treating alopecia areata acting as a functional antagonist for S1P receptor's subtypes S1PR1 and S1PR4, and more particularly, relates to a pharmaceutical composition containing as an active ingredient a sphingolipid compound acting as a functional antagonist for S1PR1 and S1PR4, does not cause cardiovascular side effects, and is effective in preventing or treating alopecia areata.
    Type: Grant
    Filed: September 26, 2023
    Date of Patent: April 16, 2024
    Assignee: NEXTGEN BIOSCIENCE CO., LTD.
    Inventors: Bong Yong Lee, Yang Hae Park, Eun Jeong Kim
  • Patent number: 11925077
    Abstract: A display apparatus includes: a display panel including a display area, and a pad area adjacent to the display area; and a circuit board attached to the pad area. The pad area includes at least one signal pad terminal electrically connected to a first signal line extending through the display area, and at least one dummy pad terminal spaced from the first signal line. The circuit board includes a signal lead terminal connected to the signal pad terminal, and a dummy lead terminal connected to the dummy pad terminal.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: March 5, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Byoung Yong Kim, Bong Hyun You
  • Patent number: 10141084
    Abstract: An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 27, 2018
    Assignee: Cheil Industries, Inc.
    Inventors: Kyoung Soo Park, Woo Suk Lee, Woo Jun Lim, Kyung Jin Lee, Bong Yong Kim, Jin Seong Park, Dong Seon Uh, Youn Jo Ko, Jang Hyun Cho, Sang Sik Bae, Jin Kyu Kim
  • Publication number: 20130213691
    Abstract: An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 22, 2013
    Inventors: Kyoung Soo PARK, Woo Suk LEE, Woo Jun LIM, Kyung Jin LEE, Bong Yong KIM, Jin Seong PARK, Dong Seon UH, Youn Jo KO, Jang Hyun CHO, Sang Sik BAE, Jin Kyu KIM
  • Publication number: 20130196129
    Abstract: An anisotropic conductive film includes a first insulating adhesive layer, a conductive adhesive layer, and a second insulating adhesive layer which are sequentially stacked on a base film, wherein an adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.1 to about 20.
    Type: Application
    Filed: March 14, 2013
    Publication date: August 1, 2013
    Inventors: Woo Suk LEE, Bong Yong KIM, Dong Seon UH, Jin Seong PARK, Kyoung Soo PARK, Woo Jun LIM, Kyung Jin LEE
  • Patent number: 8173048
    Abstract: A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: May 8, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Hyun Hee Namkung, Kyoung Soo Park, Bong Yong Kim, Kang Bae Yoon, Sang Sik Bae, Hyun Joo Seo
  • Patent number: 8003017
    Abstract: An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: August 23, 2011
    Assignee: Cheil Industries, Inc.
    Inventors: Byeong Hwan Jeon, Kyoung Soo Park, Bong Yong Kim, Young Jin Kwon, Kang Bae Yoon, Kyong Hun Shin, Hyun Hee Namkung, Hyun Joo Seo, Cheon Seok Lee
  • Publication number: 20100148130
    Abstract: A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.
    Type: Application
    Filed: December 10, 2009
    Publication date: June 17, 2010
    Inventors: Hyun Hee Namkung, Kyoung Soo Park, Bong Yong Kim, Kang Bae Yoon, Sang Sik Bae, Hyun Joo Seo
  • Publication number: 20090152505
    Abstract: An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.
    Type: Application
    Filed: December 18, 2008
    Publication date: June 18, 2009
    Inventors: Byeong Hwan Jeon, Kyoung Soo Park, Bong Yong Kim, Young Jin Kwon, Kang Bae Yoon, Kyong Hun Shin, Hyun Hee Namkung, Hyun Joo Seo, Cheon Seok Lee