Patents by Inventor Bong-Hee Park

Bong-Hee Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11993134
    Abstract: A refrigerant module of an integrated thermal management system of a vehicle is provided in which components of the module may be compactified by modularizing the components related to a refrigerant. In the refrigerant module of the integrated thermal management system for the vehicle in which the refrigerant module is configured such that a refrigerant circulates through a compressor, a condenser, an expansion valve, an evaporator, and an accumulator, the refrigerant module includes the compressor having a first suction port and a first discharge port, the condenser having a second suction port and a second discharge port, the expansion valve having a third suction port and a third discharge port, the evaporator having a fourth suction port and a fourth discharge port, the accumulator having a fifth suction port and a fifth discharge port, and a connection passage enabling the refrigerant discharged from the accumulator to flow to the compressor.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: May 28, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Wia Corporation
    Inventors: Man Ju Oh, Sang Shin Lee, Ki Mok Kim, Man Hee Kim, Se Min Lee, Bong Jun Park
  • Patent number: 11982955
    Abstract: A device to prevent fire of a fusing belt having a heater positioned inside includes at least one temperature control member adjacent to one side of the fusing belt and, when the at least one temperature control member detects abnormal heat from the fusing belt based on a temperature of the fusing belt, the at least one temperature control member to cut off a supply of electricity to the heater to prevent the fire. The device also includes a heat absorption member adjacent to the other side of the fusing belt and to absorb latent heat from the fusing belt to lower the temperature of the fusing belt to prevent the fire.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: May 14, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sun Ae Park, Bong Hee Lee, Jung Jae Lee
  • Patent number: 11981185
    Abstract: An integrated thermal management system for a vehicle may make refrigerant-related components compact by modularizing the refrigerant-related components.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: May 14, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Wia Corporation
    Inventors: Man Ju Oh, Sang Shin Lee, Ki Mok Kim, Man Hee Kim, Se Min Lee, Bong Jun Park
  • Publication number: 20240120276
    Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.
    Type: Application
    Filed: July 27, 2023
    Publication date: April 11, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Seung CHOI, Byung-Su KIM, Bong Il PARK, Chang Seok KWAK, Sun Hee PARK, Sang Joon CHEON
  • Patent number: 5794989
    Abstract: A construction capable of easily coupling or disassembling two tubes. The construction has a first annular flange of an enclosing tube protruding radially outward, a telescoped tube inserted in the enclosing tube, a first seal member inserted between an outer surface of the telescoped tube and an outside cylindrical inner surface of the enclosing tube, a second seal member inserted between the outer surface of the telescoped tube and the outside cylindrical inner surface of the enclosing tube after the first seal member is inserted, and a coupler for coupling the enclosing tube and the second seal member.
    Type: Grant
    Filed: April 3, 1997
    Date of Patent: August 18, 1998
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyu-Bok Ryu, Bong-Hee Park
  • Patent number: D730350
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wook-Hyoung Lee, Dong-Ho Shin, Bong-Hee Park, Jae-Won Choi, Soon-Jae Gwon, Jong-Gu Jeon, Mi-Ran Han, Jung-Ro Seo
  • Patent number: D730351
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wook-Hyoung Lee, Dong-Ho Shin, Jung-Ro Seo, Jong-Gu Jeon, Soon-Jae Gwon, Jae-Won Choi, Mi-Ran Han, Bong-Hee Park