Patents by Inventor Bong Hie Jung

Bong Hie Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20110266671
    Abstract: Disclosed herein are a substrate for a semiconductor package and a manufacturing method thereof. The substrate for the semiconductor package, which has a single-sided substrate structure including circuit patterns having a connection pad formed on only an electronic component mounting surface, can directly connect a connection pad on the top of the substrate to external connection terminals on the bottom of the substrate through a connection via formed of a metal plating layer formed in an inner wall of the via hole and a conductive metal paste filled in the via hole.
    Type: Application
    Filed: November 18, 2010
    Publication date: November 3, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Seop Youm, Young Hwan Shin, Kyoung Ro Yoon, Sang Duck Kim, Kyo Min Jung, Bong Hie Jung