Abstract: Disclosed is a disc-shaped sample chamber for collecting molten metal, the chamber comprising: a chamber body having a left body and a right body bonded to each other to define a disc-shaped sample space therebetween; an inlet extending upward from the chamber body and connecting the sample space with the outside; and a welded bonding portion disposed on at least one lateral face of the chamber body for bonding the left body and the right body to each other. Further, a probe having the chamber is disclosed.

Abstract: Embodiments relate to an aqueous paint composition for vehicle primer coating and a method for coating a vehicle by using the same, where the composition includes, on the basis of the weight of the entire paint composition, 20 to 50 wt % polyester resin, 1 to 20 wt % acrylic resin, 1 to 15 wt % water-dispersed urethane resin, 1 to 15 wt % urethane resin; and 10 to 30 wt % melamine curing agent.

Abstract: Embodiments relate to an aqueous paint composition for vehicle primer coating and a method for coating a vehicle by using the same, where the composition includes, on the basis of the weight of the entire paint composition, 20 to 50 wt % polyester resin, 1 to 20 wt % acrylic resin, 1 to 15 wt % water-dispersed urethane resin, 1 to 15 wt % urethane resin; and 10 to 30 wt % melamine curing agent.

Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

Abstract: Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.