Patents by Inventor BONNIE CHIA

BONNIE CHIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate support with edge seal
    Patent number: 11508610
    Abstract: Methods and apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support to support a substrate having a given diameter includes: a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface proximate the inner diameter configured to contact an upper surface of the substrate, when present, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: November 22, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chang Ke, Bonnie Chia, Song-Moon Suh, Cheng-Hsiung Tsai, Yuanhong Guo, Lei Zhou, David Langtry
  • SUBSTRATE SUPPORT WITH EDGE SEAL
    Publication number: 20190326152
    Abstract: Methods and apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support to support a substrate having a given diameter includes: a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface proximate the inner diameter configured to contact an upper surface of the substrate, when present, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 24, 2019
    Inventors: CHANG KE, BONNIE CHIA, SONG-MOON SUH, CHENG-HSIUNG TSAI, YUANHONG GUO, LEI ZHOU, DAVID LANGTRY