Patents by Inventor Bonsang Kim

Bonsang Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micromechanical device having a decoupled micromechanical structure
    Patent number: 10843917
    Abstract: A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: November 24, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Steffen Zunft, Bonsang Kim, Ando Feyh, Andrew Graham, Gary O'Brien, Michael Baus, Ralf Maier, Mariusz Koc
  • MICROMECHANICAL DEVICE HAVING A DECOUPLED MICROMECHANICAL STRUCTURE
    Publication number: 20190276305
    Abstract: A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.
    Type: Application
    Filed: April 5, 2017
    Publication date: September 12, 2019
    Inventors: Steffen Zunft, Bonsang Kim, Ando Feyh, Andrew Graham, Gary O'Brien, Michael Baus, Ralf Maier, Mariusz Koc
  • Robust Inertial Sensors
    Publication number: 20160327392
    Abstract: In one embodiment, a sensor includes a rigid wafer outer body, a first cavity located within the rigid wafer outer body, a first spring supported by the rigid wafer outer body and extending into the first cavity, a second spring supported by the rigid wafer outer body and extending into the first cavity, and a first sensor structure supported by the first spring and the second spring within the first cavity.
    Type: Application
    Filed: December 30, 2014
    Publication date: November 10, 2016
    Inventors: Bonsang Kim, Ando Feyh, Andrew Graham, Gary O'Brien, Michael Baus, Ralf Maier, Mariusz Koc
  • MULTI-LAYER DEVICES UTILIZING LAYER TRANSFER
    Publication number: 20150221627
    Abstract: An apparatus is disclosed that includes a first plurality of devices made of a group III-V semiconductor material and a second plurality of devices made of a semiconductor material different than the material of the first plurality of devices that are bonded to the first plurality of devices. The apparatus also includes a dielectric layer surrounding the first plurality of devices and the second plurality of devices to mechanically bond the first plurality of devices to the second plurality of devices.
    Type: Application
    Filed: September 25, 2013
    Publication date: August 6, 2015
    Inventors: Gregory N. Nielson, Carlos Anthony Sanchez, Anna Tauke-Pedretti, Bonsang Kim, Jeffrey Cederberg, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick