Abstract: An electronic device is provided. The electronic device includes a communication module configured to communicate with an external device, a biometric authentication module configured to perform biometric authentication, and a processor. The processor is configured to obtain biometric information of a user of the electronic device if a payment request is received, perform biometric authentication using the biometric information, send information associated with the biometric authentication to a first server located outside the electronic device, receive a session key, corresponding to the biometric authentication, from a second server located outside the electronic device, and send the session key and a payment token request to a third server located outside the electronic device.

Abstract: An electronic device for making a payment is provided. The electronic device includes a display configured to receive a user command, a transceiver configured to communicate with an external device, and a processor configured to request a token associated with a financial service from a payment server when a user requests the financial service and to generate data for providing the financial service by using the token and service information when the token and the service information associated with the financial service is received from the payment server.

Abstract: In a method of fabricating a semiconductor device, a substrate including a circuit area and an overlay mark area is provided. Conductive gate patterns are formed on the substrate in the circuit area such that the overlay mark area is free of the gate patterns, and conductive contact patterns are formed on the substrate between the gate patterns in the circuit area. A mirror pattern is formed on the substrate in the overlay mark area, where the mirror pattern and the contact patterns comprising a same reflective material. Related semiconductor devices, overlay marks, and fabrication methods are also discussed.

Abstract: An electronic device for making a payment is provided. The electronic device includes a display configured to receive a user command, a transceiver configured to communicate with an external device, and a processor configured to request a token associated with a financial service from a payment server when a user requests the financial service and to generate data for providing the financial service by using the token and service information when the token and the service information associated with the financial service is received from the payment server.

Abstract: A method of forming a pattern of a semiconductor device includes forming a mask and a sacrificial layer on a substrate, etching the sacrificial layer in a first area of the substrate to form first units, each having a first width and a first distance from an adjacent unit, etching the sacrificial layer in a second area of the substrate to form second units, each having a second width equal to the first distance and being spaced apart from an adjacent unit by a second distance equal to the first width, forming a spacer conformally covering the first and second units, the spacer having a first thickness and being merged between the second units, removing a portion of the spacer on upper surfaces of the first and second units, and etching the mask in a region from which first and second units have been removed.

Abstract: An electronic device for making a payment is provided. The electronic device includes a display configured to receive a user command, a transceiver configured to communicate with an external device, and a processor configured to request a token associated with a financial service from a payment server when a user requests the financial service and to generate data for providing the financial service by using the token and service information when the token and the service information associated with the financial service is received from the payment server.

Abstract: A method for manufacturing a semiconductor device includes forming an etch target layer on a semiconductor substrate, forming a first photoresist pattern disposed on the etch target layer, irradiating ultraviolet (UV) light in an oxygen-containing atmosphere to remove the first photoresist pattern from the etch target layer, and forming a second photoresist pattern on the etch target layer.

Abstract: A method for manufacturing a semiconductor device includes forming an etch target layer on a semiconductor substrate, forming a first photoresist pattern disposed on the etch target layer, irradiating ultraviolet (UV) light in an oxygen-containing atmosphere to remove the first photoresist pattern from the etch target layer, and forming a second photoresist pattern on the etch target layer.

Abstract: An electronic device for making a payment is provided. The electronic device includes a display configured to receive a user command, a transceiver configured to communicate with an external device, and a processor configured to request a token associated with a financial service from a payment server when a user requests the financial service and to generate data for providing the financial service by using the token and service information when the token and the service information associated with the financial service is received from the payment server.

Abstract: An electronic device is provided. The electronic device includes a communication circuit configured to communicate with a user terminal and an authentication server, a memory configured to store a plurality of one time password (OTP) generation modules and a plurality of module identification information respectively corresponding to the plurality of OTP generation modules, and a processor electrically connected with the communication circuit and the memory.

Abstract: In a method of fabricating a semiconductor device, a substrate including a circuit area and an overlay mark area is provided. Conductive gate patterns are formed on the substrate in the circuit area such that the overlay mark area is free of the gate patterns, and conductive contact patterns are formed on the substrate between the gate patterns in the circuit area. A mirror pattern is formed on the substrate in the overlay mark area, where the mirror pattern and the contact patterns comprising a same reflective material. Related semiconductor devices, overlay marks, and fabrication methods are also discussed.

Abstract: In a method of fabricating a semiconductor device, a substrate including a circuit area and an overlay mark area is provided. Conductive gate patterns are formed on the substrate in the circuit area such that the overlay mark area is free of the gate patterns, and conductive contact patterns are formed on the substrate between the gate patterns in the circuit area. A mirror pattern is formed on the substrate in the overlay mark area, where the mirror pattern and the contact patterns comprising a same reflective material. Related semiconductor devices, overlay marks, and fabrication methods are also discussed.

Abstract: Provided are a method of forming key patterns and a method of fabricating a semiconductor device using the same. The method of forming key patterns may include forming gate and key patterns on a cell region and a scribe lane region, respectively. Here, the key patterns may be formed to have a large width and a larger pitch than those of the gate patterns.

Abstract: A method of forming a pattern of a semiconductor device includes forming a mask and a sacrificial layer on a substrate, etching the sacrificial layer in a first area of the substrate to form first units, each having a first width and a first distance from an adjacent unit, etching the sacrificial layer in a second area of the substrate to form second units, each having a second width equal to the first distance and being spaced apart from an adjacent unit by a second distance equal to the first width, forming a spacer conformally covering the first and second units, the spacer having a first thickness and being merged between the second units, removing a portion of the spacer on upper surfaces of the first and second units, and etching the mask in a region from which first and second units have been removed.

Abstract: An electronic device and method are disclosed for executing electronic payments. The electronic device includes a first communication circuit for local-area communication with an external payment device, a second communication circuit for wireless communication with a second external computing device, a user interface, and memory, all electrically coupled to a processor. The processor may execute the method, including: receiving payment related information from the second external computing device using the second communication circuit, executing a payment by outputting the received payment related information to the first external computing device through the external payment device using the first communication circuit, receiving payment processing information from the second external computing device indicating a result of the executed payment, and outputting the received payment processing information.

Abstract: An electronic device is provided. The electronic device includes a communication module configured to communicate with an external device, a biometric authentication module configured to perform biometric authentication, and a processor. The processor is configured to obtain biometric information of a user of the electronic device if a payment request is received, perform biometric authentication using the biometric information, send information associated with the biometric authentication to a first server located outside the electronic device, receive a session key, corresponding to the biometric authentication, from a second server located outside the electronic device, and send the session key and a payment token request to a third server located outside the electronic device.

Abstract: A server is provided to securely provide information to a purchasing user about all memberships for which points may be accumulated in an affiliated store according to affiliated store information. The server includes a communication module to provide one-time card information to a user terminal and to obtain payment completion information, including the one-time card information and affiliated store information from a payment terminal, and a control module to determine at least one membership for which points are accumulated according to the affiliated store information, and determine whether a user of the user terminal has the at least one membership according to the one-time card information. The control module allows the communication module to provide membership information according to the determined results to the user terminal including operations permitting the user to join memberships for which points may be accumulated.

Abstract: Provided are a method of forming key patterns and a method of fabricating a semiconductor device using the same. The method of forming key patterns may include forming gate and key patterns on a cell region and a scribe lane region, respectively. Here, the key patterns may be formed to have a large width and a larger pitch than those of the gate patterns.

Abstract: In a method of fabricating a semiconductor device, a substrate including a circuit area and an overlay mark area is provided. Conductive gate patterns are formed on the substrate in the circuit area such that the overlay mark area is free of the gate patterns, and conductive contact patterns are formed on the substrate between the gate patterns in the circuit area. A mirror pattern is formed on the substrate in the overlay mark area, where the mirror pattern and the contact patterns comprising a same reflective material. Related semiconductor devices, overlay marks, and fabrication methods are also discussed.

Abstract: Disclosed are an Fe—Au barcode type nanowire and a method of manufacturing the same. The nanowire has a magnetic-optical multifunction and is suitable for adjusting magnetic intensity thereof. The Fe—Au nanowire has a multilayered structure, in which an iron layer and a gold layer are alternately and repeatedly formed, and is formed in a single plating bath through a pulse electro-deposition.