Patents by Inventor Boo-Jin Kim

Boo-Jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9223581
    Abstract: A method for operating a system on chip includes receiving an acceleration request signal generated upon execution of an application program, in response to receipt of the acceleration request signal, comparing a current usage of a central processing unit (CPU) with a threshold value to generate a comparison signal, and performing switching between heterogeneous accelerators to accelerate a function executed by the application program in response to the comparison signal.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: December 29, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Boo-Jin Kim, Je Myoung Ko, Taek Kyun Shin
  • Patent number: 8880924
    Abstract: A method of hot-plugging a multi-core processor includes monitoring respective workload levels of multiple processor cores, hot-plugging off a first core among the processor cores upon determining that its workload level has fallen below a lower reference value, and hot-plugging on a second core among the processor cores upon determining that its workload level has risen above an upper reference value while the first core is hot-plugged off.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: November 4, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Je-Myoung Ko, Boo-Jin Kim
  • Publication number: 20140215177
    Abstract: A system includes a processor and first and second memories coupled to the processor. The first and second memories have a hardware attribute, such as bandwidth, latency and/or power consumption, wherein a first value of the hardware attribute of the first memory is different from a second value of the hardware attribute of the second memory. The system further includes a memory management module configured to receive a memory allocation request. The memory management module is configured to allocate memory space in the first memory or the second memory in response to the memory allocation request based on the values of the hardware attribute of the first memory and the second memory.
    Type: Application
    Filed: April 1, 2014
    Publication date: July 31, 2014
    Inventors: Boo Jin Kim, Kang Nam PARK
  • Publication number: 20130262894
    Abstract: A system-on-chip (SoC) operates with a memory device and includes a performance monitoring unit (PMU) that measures memory usage for the memory device, and a central processing unit (CPU) configured to implement a dynamic voltage frequency scaling (DVFS) controller that compares the memory usage during a performance monitoring period with a reference value and selects a control scheme accordingly.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 3, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: JAE CHEOL LEE, Boo-Jin Kim, Jong Hwan Choi, Jung Hi Min
  • Publication number: 20130061033
    Abstract: A method for operating a system on chip includes receiving an acceleration request signal generated upon execution of an application program, in response to receipt of the acceleration request signal, comparing a current usage of a central processing unit (CPU) with a threshold value to generate a comparison signal, and performing switching between heterogeneous accelerators to accelerate a function executed by the application program in response to the comparison signal.
    Type: Application
    Filed: August 30, 2012
    Publication date: March 7, 2013
    Inventors: Boo-Jin KIM, Je Myoung Ko, Taek Kyun Shin
  • Publication number: 20120216064
    Abstract: A method of hot-plugging a multi-core processor comprises monitoring respective workload levels of multiple processor cores, hot-plugging off a first core among the processor cores upon determining that its workload level has fallen below a lower reference value, and hot-plugging on a second core among the processor cores upon determining that its workload level has risen above an upper reference value while the first core is hot-plugged off.
    Type: Application
    Filed: February 15, 2012
    Publication date: August 23, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: JE-MYOUNG KO, BOO-JIN KIM
  • Publication number: 20110245946
    Abstract: A low power audio play device, including an audio processing unit configured to decode requested audio data, the audio processing unit buffering decoded requested audio data as buffered data, and an audio output unit configured to play the buffered data when the buffered data in the audio processing unit are more than a predetermined amount, wherein a supply of power to hardware is configured to be cut off, except for power supplied to the audio output unit, while the buffered data are played.
    Type: Application
    Filed: March 30, 2011
    Publication date: October 6, 2011
    Inventors: Boo-Jin KIM, Jeongbae SEO
  • Patent number: 6346738
    Abstract: The present invention relates to a fuse option circuit of an integrated circuit and a method thereof. More particularly it concerns a fuse option circuit comprising: a first fuse formed on a chip, which is cut by providing a larger electric current than a set value; a second fuse formed on the chip identically with the first fuse; a fuse cutting means providing a cutting current loop to the first fuse in response to a fuse cutting signal; and an option signal generating means which produces a fuse option signal by comparing resistance values of the first and second fuses. Accordingly, even if the first use is abnormally cut, the fuse option can be precisely provided by comparing the first fuse having a changed resistance after cutting process with the second fuse keeping an initial resistance value. Therefore, the reliability of a fuse option of an integrated circuit can be improved.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: February 12, 2002
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Hong-Beom Kim, Boo-Jin Kim, Sang-Seok Kang