Abstract: A multi-function module is proposed. The module may be coupled to a refrigerant supply device so as to mix a composition with a refrigerant supplied from the refrigerant supply device and spray the same to the outside. The module may include a mixer configured to provide a mixing space for the refrigerant and the composition, and a combiner to be coupled to the refrigerant supply device. The module may further include a sprayer configured to spray the refrigerant into the mixing space, and an inlet configured to provide a flow path of the composition to the mixing space. The refrigerant sprayed through an outlet hole may form negative pressure at a second end of the inlet so that the composition moves to the flow path through a first end of the inlet and flows into the mixing space through the second end of the inlet.

Abstract: Proposed is a filter module including a filter that filters impurities out in the coolant emitted from a cartridge which includes a housing and a cap. The filter module may include not only a filter accommodation member including a support surface and a perforating member protruding from the support surface but also a first sealing member with a first external diameter including a through-hole fitted into the perforating member. The first sealing member may be transformed into a shape with a second external diameter—the second external diameter is smaller than the first external diameter—corresponding to the width of an inlet of the housing in which the first sealing member accommodates a cap when the cap is perforated by the perforating member.

Abstract: Proposed is a laser treatment device having a cooling system, the device including a laser module which irradiates a patient's skin with a laser, a sensing unit which detects a temperature of a surface of the patient's skin before, during, or after the skin is heated by the laser, a cooling module which includes an inlet which receives a refrigerant from a refrigerant storage unit, a nozzle which sprays the refrigerant on the skin, a conduit which connects the inlet with the nozzle, an flow rate control unit which controls a spray amount of the refrigerant by using a valve which is positioned on the conduit and connects or disconnects the inlet with or from the nozzle, and a refrigerant condition control unit which applies a thermal energy to the refrigerant by using a thermoelectric element located between the flow rate control unit and the nozzle.

Abstract: Proposed is a filter fixing module mounted to a handpiece cooling device having a connecting unit such that a refrigerant supply unit is coupled thereto, the filter fixing module including a body having a support surface formed in a plate shape, and a receiving surface formed on an edge of the support surface and protruding in a first direction relative to the support surface so as to prevent removal of a filter received in the support surface, and a grip unit connected to the body, wherein the grip unit comprises a first grip member and a second grip member extending in directions opposite to the protruding direction of the receiving surface relative to the body.

Abstract: Provided is a multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus including: a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature; and a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting.

Abstract: Proposed is a filter fixing module mounted to a handpiece cooling device having a connecting unit such that a refrigerant supply unit is coupled thereto, the filter fixing module including a body having a support surface formed in a plate shape, and a receiving surface formed on an edge of the support surface and protruding in a first direction relative to the support surface so as to prevent removal of a filter received in the support surface, and a grip unit connected to the body, wherein the grip unit comprises a first grip member and a second grip member extending in directions opposite to the protruding direction of the receiving surface relative to the body.

Abstract: Proposed is a filter fixing module mounted to a handpiece cooling device having a connecting unit such that a refrigerant supply unit is coupled thereto, the filter fixing module including a body having a support surface formed in a plate shape, and a receiving surface formed on an edge of the support surface and protruding in a first direction relative to the support surface so as to prevent removal of a filter received in the support surface, and a grip unit connected to the body, wherein the grip unit comprises a first grip member and a second grip member extending in directions opposite to the protruding direction of the receiving surface relative to the body.

Abstract: Provided is a multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus including: a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature; and a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting.