Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.

Abstract: The present disclosure relates to an induction heating type cooktop and includes a case; a cover plate configured to be coupled to the upper end of the case and provided with an upper plate portion on which an object to be heated is disposed; a working coil provided inside the case; a thin film configured to be coated on the upper plate portion and to be inductively heated by the working coil; and an adiabatic material provided between the upper plate portion and the working coil, in which the thin film may be formed to have at least one closed loop that does not include a central region of the working coil.

Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.