Patents by Inventor BOON AIK EEO

BOON AIK EEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11086407
    Abstract: A device with a keypad that includes a bezel assembled with a flexible substrate is provided. The bezel comprises: a first aperture and a second aperture separated by a retention plate. The flexible substrate comprises two or more arms joined at joining ends, and separated at distal ends, distal from the joining ends; at least one arm, of the two or more arms, comprises: a first button portion and a second button portion configured to respectively mate with the first aperture and the second aperture from a rear-side of the bezel, the first button portion and the second button portion separated by a non-button portion. The flexible substrate may be assembled with the bezel to form the keypad by inserting a distal end of the one or more arms through the first aperture from the rear-side of the bezel.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: August 10, 2021
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Sze Yen Lim, Wan Mohd Ariff Wan Sulaiman, Chi Meng Khong, Boon Aik Eeo
  • Publication number: 20210109601
    Abstract: A device with a keypad that includes a bezel assembled with a flexible substrate is provided. The bezel comprises: a first aperture and a second aperture separated by a retention plate. The flexible substrate comprises two or more arms joined at joining ends, and separated at distal ends, distal from the joining ends; at least one arm, of the two or more arms, comprises: a first button portion and a second button portion configured to respectively mate with the first aperture and the second aperture from a rear-side of the bezel, the first button portion and the second button portion separated by a non-button portion. The flexible substrate may be assembled with the bezel to form the keypad by inserting a distal end of the one or more arms through the first aperture from the rear-side of the bezel.
    Type: Application
    Filed: October 10, 2019
    Publication date: April 15, 2021
    Inventors: Sze Yen LIM, Wan Mohd Ariff Wan SULAIMAN, Chi Meng KHONG, Boon Aik EEO
  • Patent number: 10054845
    Abstract: A camera mounting mechanism for a portable communication device provides a unitary cylindrical camera housing having an opening for receiving a hemispherical camera lens of an optical sub-assembly. A heat sink wall is fitted into a base opening of the housing. Another heat sink dissipates heat from a microprocessor. A replaceable lens cap assembles to the exterior surface of the unitary cylindrical camera housing to retain and seal the camera module. The mounting of the threaded lens cap to the outside of the camera housing negates leak paths.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: August 21, 2018
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Jorge L. Garcia, Boon Aik Eeo, Ban Hin Ooi
  • Patent number: 9343800
    Abstract: A mounting apparatus (102) comprises a plurality of flexible interconnected spacer segments (104) for receiving the antenna (106), the plurality of flexible interconnected spacer segments provide a continuous offset (114) between the antenna and another surface. Each of the plurality of flexible interconnected spacer segments (104) comprises a unitarily molded flexible link, each link having a triangular cross sectional geometry (350) having an opening (108) on top (302) for receiving the antenna, and the top leading to a wider base for mounting to a surface. The links are separable (312) providing for a customizable length and form factor.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: May 17, 2016
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Chi T Tran, Parameswaran A. Sivalingam, Boon Aik Eeo, Kenney Koay, David H McClintock
  • Publication number: 20150145384
    Abstract: An enclosure includes a seal co-molded to a first material to form a sub-assembly in which the first material is securely adhered to the seal. The seal is designed to collapse in a specific direction during an injection molding process. The enclosure also includes a second material over-molded on the sub-assembly during the injection molding process. The seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming the bi-material enclosure. The first material and the second material are dissimilar materials with different thermal expansion qualities.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Applicant: MOTOROLA SOLUTIONS, INC.
    Inventors: KIOK YUNG LEE, CHEE KIT CHAN, BOON AIK EEO, WENG KONG HOR, BAN HIN OOI, CLEMENT TOBIAS XAVIER PAKIAM
  • Publication number: 20150041614
    Abstract: A mounting apparatus (102) comprises a plurality of flexible interconnected spacer segments (104) for receiving the antenna (106), the plurality of flexible interconnected spacer segments provide a continuous offset (114) between the antenna and another surface. Each of the plurality of flexible interconnected spacer segments (104) comprises a unitarily molded flexible link, each link having a triangular cross sectional geometry (350) having an opening (108) on top (302) for receiving the antenna, and the top leading to a wider base for mounting to a surface. The links are separable (312) providing for a customizable length and form factor.
    Type: Application
    Filed: August 9, 2013
    Publication date: February 12, 2015
    Applicant: MOTOROLA SOLUTIONS, INC.
    Inventors: CHI T. TRAN, PARAMESWARAN A. SIVALINGAM, BOON AIK EEO, KENNEY KOAY, DAVID H. MCCLINTOCK
  • Patent number: D899420
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 20, 2020
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Scott H. Richards, Michael Page, Boon Aik Eeo