Patents by Inventor Boon C. Teo

Boon C. Teo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-on-chip inner lead bonding lead frame method and apparatus
    Patent number: 5331200
    Abstract: A multi-level lead frame configuration (114) for an integrated circuit chip (116) comprises a main lead frame (115) having a plurality of lead frame bond fingers (122 and 124) that directly connect to a plurality of bond pads (126) on the integrated circuit chip (116). Associated with the main lead frame (115) is a bus bar lead frame (128 and 130) having a plurality of bus bar lead fingers (118 and 120) that directly connect to a second plurality of inner bond pads (126) on the integrated circuit chip (116). The bus bar bond fingers (118 and 120) associate with the main lead frame (115) and main lead frame bond fingers (122 and 124) to permit a lead-on-chip configuration of the main lead frame and the bus bar lead frame.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: July 19, 1994
    Assignee: Texas Instruments Incorporated
    Inventors: Boon C. Teo, Tjandra Karta, Siu W. Low