Patents by Inventor Boon Gooi

Boon Gooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die package and method for making the same
    Publication number: 20070001278
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Application
    Filed: June 19, 2006
    Publication date: January 4, 2007
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Gooi, Maria Cristina Estacio, David Chong, Tan Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Lim, Byoung-Ok Lee