Abstract: A configurable electronic test system that is adapted for varying test processes and thermal conditions, consisting of a device handler working with multiple testers and a thermal environment module for controlling the thermal condition during test. The test system can be easily expanded by stacking more testers vertically for more test capacity without requiring an increase in floor space.

Abstract: A configurable electronic test system that is adapted for varying test processes and thermal conditions, consisting of a device handler working with multiple testers and a thermal environment module for controlling the thermal condition during test. The test system can be easily expanded by stacking more testers vertically for more test capacity without requiring an increase in floor space.

Abstract: A method and machine (1) for underfilling an assembly (8) to form semiconductor package is disclosed. The machine (1) has conveying tracks (2) for continuously conveying the assembly (8) past zones. The assembly (8) has a flexible tape substrate (9) with a mounted inverted semiconductor die (10). The machine includes a preheating zone (3), a dispensing zone (4) for dispensing an underfill material onto the substrate (9) whilst heating the assembly (8) to allow the underfill to flow into a gap between the substrate (9) and semiconductor die (10). The machine (1) also has a postheating zone (5) for postheating the assembly (8) after dispensing to provide for a continuous flow of the underfill into the gap.

Abstract: An electronic assembly (1) having at least one semiconductor die (2) with external electrodes (3) has a foldable electrically insulating substrate (4) supporting a plurality of conductive leads (5) connected and mounted to respective ones of the electrodes (3). A plurality of external connectors (11) supported by the substrate (4) are electrically coupled to respective ones of the leads (5). The substrate (4) is folded at least once into a folded position to form at least two opposite facing surfaces (8, 9) with an adhesive and the die (2) at least partially sandwiched therebetween. The adhesive bonding the substrate (4) to the die (2) maintains the substrate (4) in the folded position.