Patents by Inventor Boon Huan Gooi

Boon Huan Gooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die package and method for making the same
    Patent number: 9159656
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: October 13, 2015
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • Semiconductor device package and method of making a semiconductor device package
    Patent number: 8912635
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: December 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Chip King Tan, Boon Huan Gooi
  • SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
    Publication number: 20140167238
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Application
    Filed: September 5, 2013
    Publication date: June 19, 2014
    Applicant: FAIRCHILD SEMICONDUCTOR CORPORATION
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • Semiconductor die package and method for making the same
    Patent number: 8664752
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: March 4, 2014
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
    Publication number: 20120181675
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Application
    Filed: March 26, 2012
    Publication date: July 19, 2012
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • Semiconductor die package and method for making the same
    Patent number: 8183088
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Grant
    Filed: June 25, 2010
    Date of Patent: May 22, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Byoung-Ok Lee
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20120068323
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Application
    Filed: November 23, 2011
    Publication date: March 22, 2012
    Applicant: Infineon Technologies AG
    Inventors: Chip King Tan, Boon Huan Gooi
  • Semiconductor device package and method of making a semiconductor device package
    Patent number: 8084299
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: December 27, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chip King Tan, Boon Huan Gooi
  • SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
    Publication number: 20100258925
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Application
    Filed: June 25, 2010
    Publication date: October 14, 2010
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20090194854
    Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 6, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Chip King Tan, Boon Huan Gooi