Patents by Inventor Boon Keng Lock

Boon Keng Lock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnect Structure And A Method Of Fabricating The Same
    Publication number: 20100246150
    Abstract: An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.
    Type: Application
    Filed: October 21, 2008
    Publication date: September 30, 2010
    Applicants: Agency for Science Tecnology and Research, Nanyang Tecnological University
    Inventors: Chee Khuen Stephen Wong, Hock Lye John Pang, Wei Fan, Haijing Lu, Boon Keng Lock