Abstract: Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

Abstract: An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.

Abstract: An electrode lead comprises a lead body, connector contacts affixed to the proximal end of the lead body, and a cuff body affixed to the distal end of the lead body. The cuff body is pre-shaped to transition from an unfurled state to a furled state, wherein the cuff body, when in the furled state has an inner surface for contacting a nerve and an overlapping inner cuff region and an outer cuff region. The electrode lead further comprise electrode contacts circumferentially disposed along the cuff body when in the furled state, such that at least one of the electrode contacts is located on the inner surface of the cuff body, and at least another of the electrode contacts is located between the overlapping inner and outer cuff regions. The electrode lead further comprises electrical conductors extending through the lead body respectively between the connector contacts and the electrode contacts.

Abstract: A lead comprising a lead body, a lead connector terminal affixed to a proximal end of the lead body, and a cuff body affixed to a distal end of the lead body, an electrode contact affixed to the cuff body, and an electrical conductor between the connector terminal and electrode contact. The lead further comprises a strap extending from a first region of the cuff body, a buckle disposed on a second region of the cuff body, and a locking feature, e.g., protuberance, ring, or wrinkle, associated with the strap. The locking feature is configured for being pulled through the buckle to dispose the cuff body around a nerve in response to a tensile force applied to the strap. The locking feature is configured for abutting an edge of the buckle in response to a release of the tensile force to secure the cuff body around the nerve.

Abstract: An electrode lead comprises an elongated lead body, at least one lead connector terminal affixed to the proximal end of the lead body, and an electrically insulative cuff body affixed to the distal end of the lead body. The cuff body is configured for being circumferentially disposed around a nerve. The cuff body comprises cutouts, slits, a wrinkled portion, a thin stretchable portion, and/or a serpentine strap, which increases that increase the expandability of the cuff body when disposed around the nerve. The electrode lead further comprises at least one electrode contact affixed to the cuff body, and at least one electrical conductor extending through the lead body between the at least one lead connector terminal and the electrode contact(s). If the cuff body comprises cutouts or slits, the electrode lead can further comprise a thin stretchable film affixed to the cuff body over cutouts or slits.

Abstract: An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.

Abstract: An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.

Abstract: Pressure sensors having ring-tensioned membranes are disclosed. A tensioning ring is bonded to a membrane in a manner that results in the tensioning ring applying a tensile force to the membrane, flattening the membrane and reducing or eliminating defects that may have occurred during production. The membrane is bonded to the sensor housing at a point outside the tensioning ring, preventing the process of bonding the membrane to the housing from introducing defects into the tensioned portion of the membrane. A dielectric may be introduced into the gap between the membrane and the counter electrode in a capacitive pressure sensor, resulting in an improved dynamic range.

Abstract: A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer.

Abstract: A visual prosthesis which includes a hermetic package and flexible circuit electrode array is disclosed. The hermetic package includes electrode drivers and contacts. The flexible circuit electrode array includes a polymer base layer, metal traces, including electrodes suitable to stimulate visual neural tissue and bond pads bonded to contacts on the hermetic package, all deposited on the polymer base layer, a polymer top layer deposited on the polymer base layer and deposited on the metal traces, a partial or an entire coating of the polymer base layer and of the polymer top layer by a soft polymer that is softer than the polymer base layer; and the polymer base layer and the polymer top layer contain a plurality of aligned holes to facilitate bonding of the soft polymer.

Abstract: A flexible circuit electrode array and method of fabrication having a polymer base layer; metal traces deposited on the polymer base layer, including electrodes to stimulate tissue; a polymer top layer deposited on the polymer base layer and metal traces; and a coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: providing a first soft polymer layer; depositing a first a base layer on the first soft polymer layer; providing a metal thin film on the base layer; depositing a top polymer layer on the metal thin film; providing holes in the top polymer layer; depositing a second soft polymer layer on the top polymer layer; providing holes in the second soft polymer layer for bond pads and electrodes; and preparing electrodes in the provided holes.

Abstract: A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) providing holes in the top polymer layer; (f) depositing a second soft polymer layer on the top polymer layer; (g) providing holes in the second soft polymer layer for bond pads and electrodes; and (h) preparing electrodes in the provided holes.