Abstract: Various example embodiments of the present disclosure provide apparatuses (e.g., applicators) for applying patterns of thermal material (e.g., dispensable thermal interface material) to components of electronic devices, such as a PCB of a memory sub-system (e.g., memory module). In particular, various example embodiments involve disposing (e.g., printing or dispensing) a thermal material pattern onto a base material, using a pre-disposed (e.g., pre-printed or pre-disposed) thermal material pattern on a base material, or both. The pattern of thermal material can correspond to one or more components of an electronic device targeted to interface with at least one heat dissipation element (e.g., a heatsink, which can be part of an electronic device enclosure).

Abstract: A memory enclosure is described that includes a debugger connector access portion in the memory enclosure. The memory enclosure further includes a breakaway tab which at least partially covers the debugger connector access portion. The memory enclosure further includes at least two anchoring joints connecting the breakaway tab to a portion of the memory enclosure surrounding the debugger connector access portion, the anchoring joints adapted to break upon application of a breaking force causing the breakaway tab to break away from the memory enclosure and allow a debugger tool access through the exterior of the memory enclosure to a debugger connector situated in the interior of the memory enclosure.

Abstract: A memory enclosure is described that includes a debugger connector access portion in the memory enclosure. The memory enclosure further includes a breakaway tab which at least partially covers the debugger connector access portion. The memory enclosure further includes at least two anchoring joints connecting the breakaway tab to a portion of the memory enclosure surrounding the debugger connector access portion, the anchoring joints adapted to break upon application of a breaking force causing the breakaway tab to break away from the memory enclosure and allow a debugger tool access through the exterior of the memory enclosure to a debugger connector situated in the interior of the memory enclosure.

Abstract: A solid state storage device includes a printed circuit board assembly, a memory arranged on the printed circuit board assembly, and a storage medium arranged on the printed circuit board assembly. The storage device further includes a processor arranged on the printed circuit board assembly, wherein the processor is coupled to the memory and to the storage medium via the printed circuit board assembly, and wherein the processor is configured to store data in the memory and the storage medium and to read data from the memory and the storage medium. The storage device further includes a removable power pack comprising a plurality of capacitors serially arranged in a housing, wherein the plurality of capacitors is detachably connected to the printed circuit board assembly to supply backup power to the processor, the memory, and the storage medium when the removable power pack is mounted in the solid state storage device.

Abstract: A solid state storage device includes a printed circuit board assembly, a memory arranged on the printed circuit board assembly, and a storage medium arranged on the printed circuit board assembly. The storage device further includes a processor arranged on the printed circuit board assembly, wherein the processor is coupled to the memory and to the storage medium via the printed circuit board assembly, and wherein the processor is configured to store data in the memory and the storage medium and to read data from the memory and the storage medium. The storage device further includes a removable power pack comprising a plurality of capacitors serially arranged in a housing, wherein the plurality of capacitors is detachably connected to the printed circuit board assembly to supply backup power to the processor, the memory, and the storage medium when the removable power pack is mounted in the solid state storage device.