Patents by Inventor Boon Khian FOO

Boon Khian FOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11899510
    Abstract: A memory enclosure is described that includes a debugger connector access portion in the memory enclosure. The memory enclosure further includes a breakaway tab which at least partially covers the debugger connector access portion. The memory enclosure further includes at least two anchoring joints connecting the breakaway tab to a portion of the memory enclosure surrounding the debugger connector access portion, the anchoring joints adapted to break upon application of a breaking force causing the breakaway tab to break away from the memory enclosure and allow a debugger tool access through the exterior of the memory enclosure to a debugger connector situated in the interior of the memory enclosure.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: February 13, 2024
    Assignee: MICRON TECHNOLOGY, INC.
    Inventor: Boon Khian Foo
  • Publication number: 20230350469
    Abstract: A memory enclosure is described that includes a debugger connector access portion in the memory enclosure. The memory enclosure further includes a breakaway tab which at least partially covers the debugger connector access portion. The memory enclosure further includes at least two anchoring joints connecting the breakaway tab to a portion of the memory enclosure surrounding the debugger connector access portion, the anchoring joints adapted to break upon application of a breaking force causing the breakaway tab to break away from the memory enclosure and allow a debugger tool access through the exterior of the memory enclosure to a debugger connector situated in the interior of the memory enclosure.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 2, 2023
    Inventor: Boon Khian Foo
  • Patent number: 8514565
    Abstract: A solid state storage device includes a printed circuit board assembly, a memory arranged on the printed circuit board assembly, and a storage medium arranged on the printed circuit board assembly. The storage device further includes a processor arranged on the printed circuit board assembly, wherein the processor is coupled to the memory and to the storage medium via the printed circuit board assembly, and wherein the processor is configured to store data in the memory and the storage medium and to read data from the memory and the storage medium. The storage device further includes a removable power pack comprising a plurality of capacitors serially arranged in a housing, wherein the plurality of capacitors is detachably connected to the printed circuit board assembly to supply backup power to the processor, the memory, and the storage medium when the removable power pack is mounted in the solid state storage device.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: August 20, 2013
    Assignee: STEC, Inc.
    Inventors: Boon Khian Foo, Rajan Bhakta, Mark Moshayedi
  • Publication number: 20120236489
    Abstract: A solid state storage device includes a printed circuit board assembly, a memory arranged on the printed circuit board assembly, and a storage medium arranged on the printed circuit board assembly. The storage device further includes a processor arranged on the printed circuit board assembly, wherein the processor is coupled to the memory and to the storage medium via the printed circuit board assembly, and wherein the processor is configured to store data in the memory and the storage medium and to read data from the memory and the storage medium. The storage device further includes a removable power pack comprising a plurality of capacitors serially arranged in a housing, wherein the plurality of capacitors is detachably connected to the printed circuit board assembly to supply backup power to the processor, the memory, and the storage medium when the removable power pack is mounted in the solid state storage device.
    Type: Application
    Filed: July 23, 2010
    Publication date: September 20, 2012
    Applicant: STEC, INC.
    Inventors: Boon Khian FOO, Rajan Bhakta, Mark Moshayedi