Abstract: A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.

Abstract: Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the leadframe. The leadframe includes a first main face opposite a second main face and a plurality of edges extending between the first and second main faces. At least one of the plurality of edges includes a first profiled element and a second profiled element different than the first profiled element. The encapsulation material is disposed over the chip and the plurality of edges of the leadframe.

Abstract: A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.

Abstract: A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package includes a semiconductor die coupled to the first major surface, and an encapsulating material formed about the semiconductor chip and a portion of the first major surface of the leadframe and filling all but a portion of the mold lock opening, the unfilled portion of the mold lock opening forming a vent extending from the second major surface to the first major surface, the vent providing a pathway for air to escape from between the second major surface and a surface to which the second major surface is to be attached.

Abstract: A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package includes a semiconductor die coupled to the first major surface, and an encapsulating material formed about the semiconductor chip and a portion of the first major surface of the leadframe and filling all but a portion of the mold lock opening, the unfilled portion of the mold lock opening forming a vent extending from the second major surface to the first major surface, the vent providing a pathway for air to escape from between the second major surface and a surface to which the second major surface is to be attached.

Abstract: Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the leadframe. The leadframe includes a first main face opposite a second main face and a plurality of edges extending between the first and second main faces. At least one of the plurality of edges includes a first profiled element and a second profiled element different than the first profiled element. The encapsulation material is disposed over the chip and the plurality of edges of the leadframe.