Patents by Inventor Boon Kiat Alex Chew

Boon Kiat Alex Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7307443
    Abstract: A test socket for an integrated circuit, wherein the test socket has a first plurality of test points for making electrical contact with contacts of a laminate package and a second plurality of test points for making electrical contact with contacts of a lead frame package. The test socket is suitable for testing, at one time: a laminate package, or a lead frame package, or both a laminate package and a lead frame package.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: December 11, 2007
    Assignee: Infineon Technologies AG
    Inventors: Chye Lin Toh, Boon Kiat Alex Chew