Patents by Inventor Boon Lee
Boon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240079319Abstract: An eFuse structure is provided, the structure comprising a first fuse link having a first side. The first fuse link having a first indentation on the first side, the first indentation having a non-linear profile. A first dummy structure may be laterally spaced from the first indentation of the first fuse link.Type: ApplicationFiled: September 7, 2022Publication date: March 7, 2024Inventors: SHU HUI LEE, JUAN BOON TAN, JIANXUN SUN, HARI BALAN, MYO AUNG MAUNG
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Publication number: 20240071948Abstract: A semiconductor package is provided including: a package substrate with a top surface, wherein the top surface extends to a peripheral side surface of the package substrate; a stiffener with a lateral portion and a basket portion, wherein the lateral portion is positioned over the top surface of the package substrate and the basket portion overhangs from the top surface of the package substrate adjacent to the peripheral side surface of the package substrate; at least one semiconductor die positioned in the basket portion of the stiffener; and at least one wire attached to the at least one semiconductor die and extending out of the basket portion of the stiffener.Type: ApplicationFiled: August 25, 2022Publication date: February 29, 2024Inventors: Jiun Hann SIR, Eng Huat GOH, Poh Boon KHOO, Nurul Khalidah YUSOP, Saw Beng TEOH, Chan Kim LEE
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Publication number: 20220154080Abstract: A system for recovering natural gas liquid from a gas source, comprising compression means (206) for increasing the temperature and pressure of the fluid from the gas source, cooling means (230) for cooling the fluid from the compression means, a gas/gas heat exchanger (204), fluid from the gas source flowing from a first inlet to a first outlet; at least one separator (208) for receiving the fluid from the first outlet of the gas/gas heat exchanger (204) and separating liquid from the gas, the gas from the separator being directed to expansion means (206) for reducing the temperature and pressure of the gas, the aqueous part of the liquid from the separator and/or the gas from the expansion means being directed to the gas/gas heat exchanger (204) where it flows therethrough from a second inlet to a second outlet for cooling the fluid flowing between the first inlet and first outlet, wherein injection means are provided between the cooling means and the gas/gas heat exchanger for saturating the gas with a liqType: ApplicationFiled: March 13, 2020Publication date: May 19, 2022Applicant: NGLTech Sdn. Bhd.Inventors: Arul Jothy A/L Suppiah, Boon Lee Ooi, Ching Liang Chen, Ebtehal Eisa Regheb Eisa Farag, Dhanaraj A/L Turunawarasu
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Patent number: 10943613Abstract: A thermally assisted magnetic head including a slider and a light source-unit. The slider includes a slider substrate and a magnetic head part. The light source-unit includes a laser diode and a sub-mount. The magnetic head part includes a medium-opposing surface, a light source-opposing surface and a waveguide which guides laser light from the light source-opposing surface to the medium-opposing surface. The slider substrate includes a light source-cavity formed in a light source-placing surface on which the light source-unit is placed. The light source-cavity includes an opening concave part being formed larger than a mount bottom surface of the sub-mount. The mount bottom surface of the sub-mount is inserted into the opening concave part to be joined to the light source-cavity.Type: GrantFiled: March 13, 2020Date of Patent: March 9, 2021Assignees: SAE Magnetics (H.K.) Ltd., Headway Technologies, Inc.Inventors: Ryo Hosoi, Takashi Honda, Seiichi Takayama, Sik Fun Chan, Tai Boon Lee, Dayu Zhou
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Patent number: 10760357Abstract: Systems and methods related to a drilling rig or a drill ship having a first activity center with a main well, a second activity center with an auxiliary well and a third activity center with offline casing with drill pipe stand-building capabilities. The offline casing and drill stand-building facility is a standalone feature and can be located in the forward or aft side of a drilling rig or drill ship depending on the choice of the builder or operator.Type: GrantFiled: July 31, 2019Date of Patent: September 1, 2020Assignee: KEPPEL OFFSHORE & MARINE TECHNOLOGY CENTRE PTE LTDInventors: Boon Lee Tan, Anis Altaf Hussain, Aziz Amirali Merchant, Leng Yeow Ong, Boon Seng Lim, Yizhe Lester Phong
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Publication number: 20190352981Abstract: This invention relates to a drilling rig or a drill ship having a first activity centre with a main well, a second activity centre with an auxiliary well and a third activity centre with offline casing and drill pipe stand-building capabilities. The offline casing and drill pipe stand-building facility is a standalone feature and can be located in the forward or aft side of a drilling rig or drill ship depending on the choice of the builder or operator.Type: ApplicationFiled: July 31, 2019Publication date: November 21, 2019Inventors: Boon Lee TAN, Anis Altaf Hussain, Aziz Amirali MERCHANT, Leng Yeow ONG, Boon Seng LIM, Yizhe Lester PHONG
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Publication number: 20190225891Abstract: A system (102; 302) for recovering natural gas liquid from a low pressure gas source (110; 310), comprising a gas/gas heat exchanger (104; 304), fluid from the gas source flowing therethrough; at least one separator (108; 308) for receiving the fluid from the gas/gas heat exchanger (104; 304) and separating liquid from the gas, the gas being directed via a connecting pipe (116; 316) to the gas/gas heat exchanger (104; 304) where it cools the fluid from the gas source; characterised in that the connecting pipe (116; 316) includes expansion means (106; 322) for cooling the gas therein and liquid injection means (120; 320) for saturating the gas with liquid.Type: ApplicationFiled: July 10, 2017Publication date: July 25, 2019Applicant: NGLTECH SDN. BHD.Inventors: Arul Jothy A/L Suppiah, Hafiy Bin Halil, Haravinth A/L A. Thiruthonder, Boon Lee Ooi
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Publication number: 20160053558Abstract: This invention relates to a drilling rig or a drill ship having a first activity centre with a main well, a second activity centre with an auxiliary well and a third activity centre with offline casing and drill pipe stand-building capabilities. The offline casing and drill pipe stand-building facility is a standalone feature and can be located in the forward or aft side of a drilling rig or drill ship depending on the choice of the builder or operator.Type: ApplicationFiled: April 4, 2014Publication date: February 25, 2016Applicant: Keppel Offshore & Marine Technology Centre Pte LtdInventors: Boon Lee Tan, Anis Altaf Hussain, Aziz Amirali Merchant, Leng Yeow Ong, Boon Seng Lim, Yizhe Lester Phong
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Publication number: 20150255547Abstract: Structures for III-nitride GaN high electron mobility transistors (HEMT), method for fabricating for GaN devices and integrated chip-level power systems using the GaN devices are provided. The GaN HEMT structure includes a substrate, an AlGaN/GaN heterostructure grown on the substrate, and a normally-off GaN device fabricated on the AlGaN/GaN heterostructure. The AlGaN/GaN heterostructure includes a GaN buffer layer and an AlGaN barrier layer. The integrated chip-level power system includes a substrate, an AlGaN/GaN heterostructure layer grown on the substrate and a plurality of GaN devices. The AlGaN/GaN heterostructure layer includes a GaN buffer layer and an AlGaN barrier layer and is formed into mesa areas and valley areas. Each of the plurality of GaN devices are fabricated on a separate one of the mesa areas.Type: ApplicationFiled: March 28, 2013Publication date: September 10, 2015Applicant: Agency for Science, Technology and ResearchInventors: Li Yuan, Patrick Guo Qiang Lo, Haifeng Sun, Kean Boon Lee, Weizhu Wang, Susai Lawrence Selvaraj
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Patent number: 8864881Abstract: A slug suppressor apparatus comprising an inlet separator capable of gas-liquid separation of full well stream fluid and expanded inclined liquid pipe for dampening slugs. The inlet separator has an inlet for receiving the full well stream fluid, a separated gas outlet in its upper section, and a separated liquid outlet in its lower section. The separated gas outlet and the separated outlet are operationally connected to a gas bypass line and the expanded inclined liquid pipe respectively. The expanded inclined liquid pipe has means for dampening liquid slugs and is connectable to a 3-Phase separator.Type: GrantFiled: September 1, 2010Date of Patent: October 21, 2014Assignee: NGLTech SDN. BHD.Inventors: Aruljothy Suppiah, Boon Lee Ooi
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Patent number: 8861318Abstract: A thermally assisted magnetic write head includes a waveguide having a first end surface included in an air bearing surface; a magnetic pole having a second end surface included in the air bearing surface; a plasmon generator having a third end surface included in the air bearing surface; a first protective film directly covering a part of the second end surface of the magnetic pole at least; and a second protective film directly covering the first end surface of the waveguide and the third end surface of the plasmon generator. The configuration can reduce recording density and improve thermal stability, furthermore increase the producing yield.Type: GrantFiled: December 5, 2013Date of Patent: October 14, 2014Assignees: SAE Magnetics (H.K.) Ltd., TDK CorporationInventors: Tai Boon Lee, Bing Ma, Wei Liang Chen, Hong Tao Ma, Yasutoshi Fujita, Hideki Tanzawa, Ryuji Fujii, Kei Hirata, Makoto Isogai, Takeshi Tsutsumi
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Patent number: 8743665Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off.Type: GrantFiled: May 29, 2013Date of Patent: June 3, 2014Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Ryuji Fujii, Tai Boon Lee, Hideki Tanzawa, Yasuhiro Konakawa
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Publication number: 20140001097Abstract: A method for the production of stabilized crude oil, the method comprising the steps of: providing a stream of crude oil; injecting steam into said stream and so stripping C3? from said stream; providing a gas stream; extracting C4+ from the gas stream, and so; producing a stream from the extracted C4+; co-mingling the stripped stream with the C4+ stream, and so; producing a stream of stabilized crude oil.Type: ApplicationFiled: March 16, 2012Publication date: January 2, 2014Applicant: NGLTECH SDN. BHD.Inventors: Arul Jothy, Boon Lee Ool, Weng Loong Hum
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Patent number: 8588040Abstract: A thermally assisted magnetic head slider includes an air bearing surface facing to a magnetic recording medium, a read portion, and a write portion including a write element, a waveguide for guiding light generated by the light source module, and a plasmon unit provided around the write portion and the waveguide. A first coat layer with a first thickness which has a first light absorption index is covered on an opposed-to-medium surface of the read portion, and a second coat layer with a second thickness which has a second light absorption index is covered on an opposed-to medium surface of the write portion, wherein the second thickness is larger than the first thickness, and the second light absorption index is smaller than the first light absorption index. The slider can protect the write portion and improve the reading performance of the read portion.Type: GrantFiled: December 21, 2012Date of Patent: November 19, 2013Assignees: SAE Magnetics (H.K.) Ltd., TDK CorporationInventors: Yasutoshi Fujita, Ryuji Fujii, Hideki Tanzawa, Natsuo Nishijima, Tai Boon Lee, Jian Hui Huang, Huan Chao Liang, Koji Shimazawa, Kei Hirata, Daisuke Miyauchi
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Publication number: 20130258823Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off.Type: ApplicationFiled: May 29, 2013Publication date: October 3, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Ryuji FUJII, Tai Boon LEE, Hideki TANZAWA, Yasuhiro KONAKAWA
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Patent number: 8537643Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole.Type: GrantFiled: November 25, 2011Date of Patent: September 17, 2013Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Ryuji Fujii, Tai Boon Lee, Hideki Tanzawa, Yasuhiro Konakawa
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Publication number: 20130136885Abstract: A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole.Type: ApplicationFiled: November 25, 2011Publication date: May 30, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Ryuji FUJII, Tai Boon Lee, Hideki Tanzawa, Yasuhiro Konakawa
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Patent number: 8327710Abstract: A system is provided for estimating a condition of a non-conductive hollow structure exposed to a lightning strike. The structure has an internal cavity. The system includes a pressure transducer to measure a pressure of an acoustic wave generated within the internal cavity due to the lightning strike. The system further includes a controller coupled to the pressure transducer, to receive the measured pressure from the pressure transducer, and to process the condition of the structure, based on the measured pressure.Type: GrantFiled: July 29, 2010Date of Patent: December 11, 2012Assignee: General Electric CompanyInventors: Glen Peter Koste, Boon Lee, Robert Murray, Yaru Mendez Hernandez, Paul Judge
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Publication number: 20120160103Abstract: A slug suppressor apparatus comprising an inlet separator capable of gas-liquid separation of full well stream fluid and expanded inclined liquid pipe for dampening slugs. The inlet separator has an inlet for receiving the full well stream fluid, a separated gas outlet in its upper section, and a separated liquid outlet in its lower section. The separated gas outlet and the separated outlet are operationally connected to a gas bypass line and the expanded inclined liquid pipe respectively. The expanded inclined liquid pipe has means for dampening liquid slugs and is connectable to a 3-Phase separator.Type: ApplicationFiled: September 1, 2010Publication date: June 28, 2012Inventors: Aruljothy Suppiah, Boon Lee Ooi
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Publication number: 20120077314Abstract: Methods of fabricating a semiconductor stack package having a high capacity, a small volume and reliability. According to the method of fabricating a semiconductor stack package, a first semiconductor substrate including a plurality of first semiconductor chips is attached to a chip protection film. The chip protection film is expanded such that the plurality of the first semiconductor chips are spaced apart from each other. A plurality of second semiconductor chips are attached to the plurality of the first semiconductor chips, respectively. A molding layer is formed between the plurality of the first semiconductor chips and between the plurality of the second semiconductor chips. The molding layer and the chip protection film are sawed to separate the semiconductor stack package comprising the first semiconductor chip and the second semiconductor chip into a unit.Type: ApplicationFiled: September 23, 2011Publication date: March 29, 2012Applicant: Samsung Electronics Co., Ltd.Inventors: Sang-sick PARK, Dong-hyeon JANG, Chang-seong JEON, Teak-boon LEE