Patents by Inventor Boon Long Lau

Boon Long Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid cooling module and method of forming the same
    Patent number: 11948861
    Abstract: Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: April 2, 2024
    Assignee: Agency for Science, Technology and Research
    Inventors: Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang
  • LIQUID COOLING MODULE AND METHOD OF FORMING THE SAME
    Publication number: 20220051967
    Abstract: Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.
    Type: Application
    Filed: August 19, 2019
    Publication date: February 17, 2022
    Inventors: Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang
  • Heat sinks and methods for fabricating a heat sink
    Patent number: 11101194
    Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: August 24, 2021
    Assignee: Agency for Science, Technology and Research
    Inventors: Yong Han, Boon Long Lau, Daniel Minwo Rhee
  • HEAT SINKS AND METHODS FOR FABRICATING A HEAT SINK
    Publication number: 20200029463
    Abstract: According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.
    Type: Application
    Filed: December 19, 2017
    Publication date: January 23, 2020
    Inventors: Yong Han, Boon Long Lau, Daniel Minwo Rhee