Patents by Inventor Boon Neo

Boon Neo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR CONTROLLING POLISHING PROCESS
    Publication number: 20070138140
    Abstract: The invention is directed to a method for controlling a polishing process. The method comprises steps of providing a first wafer, wherein a thin film is located over the first wafer. A film average thickness distribution is obtained by measuring a plurality of thickness values of the thin film on a plurality regions over the wafer respectively. A removal rate recipe is determined according to the film average thickness distribution. A polishing process is performed according to the removal rate recipe.
    Type: Application
    Filed: December 15, 2005
    Publication date: June 21, 2007
    Inventors: Ching-Wen Teng, Chin-Kun Lin, Boon Neo